
Printed Electronics for Smart Packaging
Wei Wu(Author)
Wiley-VCH (Publisher)
1st Edition
Published on 24. December 2025
Book
Hardback
320 pages
978-3-527-35116-9 (ISBN)
Description
Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging
Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.
Written by a highly qualified academic, Printed Electronics for Smart Packaging covers sample topics such as:
* Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
* Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
* Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
* Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field
A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.
Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.
Written by a highly qualified academic, Printed Electronics for Smart Packaging covers sample topics such as:
* Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
* Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
* Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
* Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field
A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.
More details
Edition
1. Auflage
Language
English
Place of publication
Berlin
Germany
Target group
Professional and scholarly
Illustrations
1
1 s/w Tabelle
1 schwarz-weiße Tabellen
Dimensions
Height: 249 mm
Width: 177 mm
Thickness: 22 mm
Weight
745 gr
ISBN-13
978-3-527-35116-9 (9783527351169)
Schweitzer Classification
Other editions
Additional editions

E-Book
11/2025
1st Edition
Wiley-VCH
€124.99
Available for download

E-Book
10/2025
1st Edition
Wiley-VCH
€124.99
Available for download
Person
Wei Wu received his Ph.D. degree in materials physics and chemistry from Wuhan University in 2011. He then joined the group of Prof. Daiwen Pang at Wuhan University (2011) and Prof. V. A. L. Roy at City University of Hong Kong (2014) as a postdoctoral fellow. Currently, he is the full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014. He has published over 100 papers, which have received over 7500 citations. His research interests include the synthesis and application of printable functional materials, printed electronics, wearable electronics and intelligent packaging.
Jing Liang, PhD, Laboratory of Printable Functional Materials and Printed Electronics, School of Printing and Packaging, Wuhan University in China.
Jing Liang, PhD, Laboratory of Printable Functional Materials and Printed Electronics, School of Printing and Packaging, Wuhan University in China.
Content
Chapter 1 Introduction of Printed Electronics and Smart Packaging
Chapter 2 Mechanisms and Strategies of Smart Packaging
Chapter 3 Printing Methods and Integrated Strategies
Chapter 4 Functional Inks and Substrates for Smart Packaging
Chapter 5 Printed Tracks for Smart Tags and Packaging
Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging
Chapter 7 Printed Sensors and Indicators
Chapter 8 Integrated Printed Electronics Systems
Chapter 9 Outlooks and Perspectives
Chapter 2 Mechanisms and Strategies of Smart Packaging
Chapter 3 Printing Methods and Integrated Strategies
Chapter 4 Functional Inks and Substrates for Smart Packaging
Chapter 5 Printed Tracks for Smart Tags and Packaging
Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging
Chapter 7 Printed Sensors and Indicators
Chapter 8 Integrated Printed Electronics Systems
Chapter 9 Outlooks and Perspectives