
Technology of Integrated Circuits
Springer (Publisher)
Published on 21. October 2010
Book
Paperback/Softback
XVIII, 342 pages
978-3-642-08547-5 (ISBN)
Description
Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.
More details
Series
Edition
Softcover reprint of hardcover 1st ed. 2000
Language
English
Place of publication
Berlin
Germany
Publishing group
Springer Berlin
Target group
Professional and scholarly
Research
Illustrations
XVIII, 342 p.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 20 mm
Weight
546 gr
ISBN-13
978-3-642-08547-5 (9783642085475)
DOI
10.1007/978-3-662-04160-4
Schweitzer Classification
Other editions
Additional editions

D. Widmann | H. Mader | H. Friedrich
Technology of Integrated Circuits
Book
07/2000
Springer
€160.49
Shipment within 7-9 days
Content
1 Introduction.- 2 Basic principles of integrated circuits technology.- 3 Film technology.- 4 Lithography.- 5 Etching technology.- 6 Doping technology.- 7 Cleaning technology.- 8 Process integration.- References.