RF Measurements of Die and Packages
Published on 31. May 2002
Book
Hardback
244 pages
978-1-58053-273-0 (ISBN)
Description
This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. This book should be of interest to: RFIC designers and high-frequency digital IC designers, IC test engineers and IC manufacturing test engineers.
More details
Series
Edition
New
Language
English
Place of publication
Norwood
United States
Target group
Professional and scholarly
Product notice
Laminated cover
Illustrations
black & white illustrations
Dimensions
Height: 235 mm
Width: 162 mm
Thickness: 22 mm
Weight
513 gr
ISBN-13
978-1-58053-273-0 (9781580532730)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Scott A. Wartenberg
RF Measurements of Die and Packages
E-Book
06/2002
1st Edition
Artech House
€150.99
Available for download
Scott A. Wartenberg
RF Measurements of Die and Packages
E-Book
05/2002
Artech House
€149.99
Available for download
Person
Scott A. Wartenberg is a staff engineer at RF Micro Devices and has done RF/microwave work at Agilent Technologies, Westinghouse, Raytheon, and the U.S. Department of Defense. A senior member of the IEEE and a member of the Microwave Theory and Techniques Society, he holds a Ph.D. and M.S. in Electrical Engineering from the Johns Hopkins University, and a B.S. in Electrical Engineering from the University of Tennessee. He has published extensively.
Content
Preface. Introduction, Calibration, Coplanar Probes. High-Volume Probing. Test Fixtures. On-Wafer Characterization. RF Test Systems. Package Characterization. Future Trends. Appendix.