
Integrated Passive Component Technology
Wiley-IEEE Press
Published on 11. July 2003
Book
Hardback
380 pages
978-0-471-24431-8 (ISBN)
Description
This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
* Describes the processes available for creating integrated passives, measuring their properties, and applying them.
* Brings reader up to date in a fast-moving technology.
* Enables reader to implement the technology into a manufacturing environment.
* Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
* Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
Reviews / Votes
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)More details
Product info
gebunden
Edition
1. Auflage
Language
English
Place of publication
United States
Publishing group
John Wiley & Sons Inc
Target group
Professional and scholarly
Product notice
sewn/stitched
Cloth over boards
Dimensions
Height: 240 mm
Width: 161 mm
Thickness: 26 mm
Weight
768 gr
ISBN-13
978-0-471-24431-8 (9780471244318)
Schweitzer Classification
Persons
RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division.
LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.
Content
Introduction.
Characteristics and Performance of Planar Resistors.
Integrated Resistor Materials and Processes.
DIelectric Materials for Integrated Capacitors.
Size and Configuration for Integrated Capacitors.
Processing Integrated Capacitors.
Defect and Yield Issues.
Electrical Performance of Integrated Capacitors.
Decoupling.
Integrated Inductors.
Modeling Integrated Resistors and inductors for Microwave Applications.
Other Applications and Integration Technologies.
The Economic of Embedded Passives.
The Future of Integrated Passives.