
Polymers for Microelectronics
Resists and Dielectrics
American Chemical Society (Publisher)
Published on 1. January 1994
Book
Hardback
554 pages
978-0-8412-2721-7 (ISBN)
Description
Presents recent advances in chemically amplified resists for deep UV, electron beam, and X-ray advanced lithographic technologies. Discusses top surface imaging and dry development resists. Examines the fundamental chemistry of radiation-sensitive materials, including dielectric polymers for integrated circuits and interconnect systems. Valuable reading for polymer chemists, radiation chemists, and materials scientists.
More details
Series
Language
English
Place of publication
Washington
United States
Target group
Professional and scholarly
Dimensions
Height: 234 mm
Width: 158 mm
Thickness: 32 mm
Weight
880 gr
ISBN-13
978-0-8412-2721-7 (9780841227217)
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Schweitzer Classification
Content
Chemical Amplification Mechanisms for Microlithography ; Synthesis of 4-(tert-Butoxycarbonyl)-2,6-dinitrobenzyl Tosylate: A Potential Generator and Dissolution Inhibitor Solubilizable through Chemical Amplification ; Chemically Amplified Deep-UV Photoresists Based on Acetal-Protected Poly(vinylphenols) ; Novel Analytic Method of Photoinduced Acid Generation and Evidence of Photosensitization via Matrix Resin ; Acid-Catalyzed Dehydration: A New Mechanism for Chemically Amplified Lithographic Imaging ; An Alkaline-Developable Positive Resist Based on Silylated Polyhydroxystyrene for KrF Excimer Laser Lithography ; A Test for Correlation between Residual Solvent and Rates of N-Methylpyrrolidone Absorption by Polymer Films ; Dissolution Rates of Copolymers Based on 4-Hydroxystyrene and Styrene ; Synthesis and Polymerization of N-(tert-Butoxy)maleimide and Application of Its Polymers as a Chemical Amplification Resist ; Acid-Sensitive Pyrimidine Polymers for Chemical Amplification Resists ; Methacrylate Terpolymer Approach in the Design of a Family of Chemically Amplified Positive Resists ; Surface-Imaging Resists Using Photogenerated Acid-Catalyzed SiO[2 Formation by Chemical Vapor Deposition ; Polysilphenylenesiloxane Resist with Three-Dimensional Structure ; Top-Surface Imaging Using Selective Electroless Metallization of Patterned Monolayer Films ; Langmuir-Blodgett Deposition To Evaluate Dissolution Behavior of Multicomponent Resists ; Photochemical Control of a Morphology and Solubility Transformation in Poly(vinyl alcohol) Films Induced by Interfacial Contact with Siloxanes and Phenol-Formaldehyde Polymeric Photoresists ; Advances in the Chemistry of Resists for Ionizing Radiation ; Out-of-Plane Expansion Measurements in Polyimide Films ; Radiation-Induced Modifications of Allylamino-Substituted Polyphosphazenes ; Synthesis of Perfluorinated Polyimides for Optical Applications ; Charged Species in *s-Conjugated Polysilanes as Studied by Absorption Spectroscopy with Low-Temperature Matrices ; Acid-Sensitive Phenol-Formaldehyde Polymeric Resists ; Superiority of Bis(perfluorophenyl) Azides over Nonfluorinated Analogues as Cross-Linkers in Polystyrene-Based Deep-UV Resists ; New Photoresponsive Polymers Bearing Norbornadiene Moiety Synthesis by Selective Cationic Polymerization of 2-(3-Phenyl-2,5-norbornadiene-2-carbonyloxy)ethyl Vinyl Ether and Photochemical Reaction of the Resulting Polymers ; Photoinitiated Thermolysis of Poly(5-norbornene 2, 3-dicarboxylates): A Way to Polyconjugated Systems and Photoresists ; Recent Progress of the Application of Polyimides to Microelectronics ; Base-Catalyzed Cyclization of ortho-Aromatic Amide Aklyl Esters: A Novel Approach to Chemical Imidization ; Base-Catalyzed Photosensitive Polyimide ; Novel Cross-Linking Reagents Based on 3,3-Dimethyl-1-phenylenetriazene ; Preparation of Novel Photosensitive Polyimide Systems via Long-Lived Active Intermediates ; Photoregulation of Liquid-Crystalline Orientation by Anisotropic Photochromism of Surface Azobenzenes ; Factors Affecting the Stability of Polypyrrole Films at Higher Temperatures ; Intrinsic and Thermal Stress in Polyimide Thin Films ; Fluorinated, Soluble Polyimides with High-Glass-Transition Temperatures Based on a New, Rigid, Pentacyclic Dianhydride: 12,14-Diphenyl-12,14-bis(trifluoromethyl )-12H,14H-5,7-dioxapentacene-2,3,9,10-tetracarboxylic Dianhydride ; Processable Fluorinated Acrylic Resins with Low Dielectric Constants ; Enhanced Processing of Poly(tetrafluoroethylene) for Microelectronics Applications ; Fluorinated Poly(arylene ethers) with Low Dielectric Constants ; Microstructural Characterization of Thin Polyimide Films by Positron Lifetime Spectroscopy ; Synthesis and Characterization of New Poly(arylene ether oxadiazoles)