
Materials, Integration and Technology for Monolithic Instruments: Volume 869
Volume 869
Cambridge University Press
Published on 5. June 2014
Book
Paperback/Softback
186 pages
978-1-107-40895-1 (ISBN)
Description
The field of integrated circuits is now on the cusp of a new level of integration that can enable an entirely new class of products - monolithic instruments. These are miniaturized systems which interact with their physical environment in ways traditional integrated circuits cannot, in particular, by combining conventional integrated circuits with novel solid-state components. These systems are enabled by utilizing the extremely precise manufacturing platform that is the integrated circuit wafer fabrication facility. The monolithic instrument concept is quite powerful in that it enables vast cost and size reductions. The papers presented in this book are a subset of what is possible in this field. Section I examines advanced image sensor concepts based on forming the photodetector above the standard CMOS interconnect. Section II focuses on optoelectronic element integration, including critical components for constructing miniaturized spectrometers. Section III features chemical and biological sensing systems. Section IV highlights functional oxides and other materials for monolithic integration.
More details
Series
Language
English
Place of publication
Cambridge
United Kingdom
Target group
College/higher education
Professional and scholarly
Product notice
Paperback (trade)
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 10 mm
Weight
279 gr
ISBN-13
978-1-107-40895-1 (9781107408951)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

Jeremy A. Theil | Markus Boehm | Donald S. Gardner
Materials, Integration and Technology for Monolithic Instruments: Volume 869
Book
07/2005
Materials Research Society
€54.65
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Persons
Editor
Universitaet Siegen, Germany
University of Virginia