Wafer-Level Integrated Systems
Implementation Issues
Published on 31. March 1989
Book
Hardback
XVI, 456 pages
978-0-7923-9006-0 (ISBN)
Description
From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
More details
Series
Edition
1989 ed.
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Product notice
sewn/stitched
Cloth over boards
Illustrations
XVI, 456 p.
Dimensions
Height: 234 mm
Width: 156 mm
Thickness: 27 mm
Weight
844 gr
ISBN-13
978-0-7923-9006-0 (9780792390060)
DOI
10.1007/978-1-4613-1625-1
Schweitzer Classification
Other editions
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12/2012
Springer
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02/2012
Springer
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Content
1. Introduction and Overview.- 1.1 Device vs System Scaling.- 1.2 Major Implementation Issues.- 1.3 ESPRIT 824 WSI Program.- References.- 2. Interconnect Issues.- 2.1 Physical Interconnect Hierarchy.- 2.2 Recursive vs Non-Recursive Interconnect Links.- 2.3 On-Chip Interconnect Lengths.- 2.4 Inter-Chip Connection Lengths.- 2.5 Electrical Models of Interconnection Lines.- 2.6 Minimum Line Capacitance.- 2.7 Scaling of On-Chip Interconnections.- 2.8 Chip-to-Board Interconnect Discontinuity.- 2.9 Comparison of Packaging Schemes.- 2.10 Clock Distribution and Clock Skew.- References.- 3. Fabrication Defects.- 3.1 Substrate defects.- 3.2 Lithography-induced defects.- 3.3 Thin Film Defects.- References.- 4. Reliability and Failures.- 4.1 Failure rate modeling.- 4.2 General reliability of IC's.- 4.3 Failure due to metal electromigration.- 4.4 Failure rates under MOS dimensional and voltage scaling laws.- References.- 5. Yield models and Analysis.- 5.1 General yield models.- 5.2 Early yield models.- 5.3 General IC yield models.- 5.4 VLSI yield models based on yield observations.- 5.5 Defect size distributions and critical areas.- 5.6 Yield simultion in VLSI CAD tools.- 5.7 Appendix.- References.- 6. Fault Modeling.- 6.1 General fault modeling issues.- 6.2 Definitions.- 6.3 Stuck-at faults and weak 0/1 faults.- 6.4 "Stuck" transistor faults.- 6.5 Bridging faults.- 6.6 Metastability in latches and flip-flops.- References.- 7. General testing techniques.- 7.1 General Test issues.- 7.2 Scan path test design.- 7.3 LSSD-based Test Methodologies.- 7.4 Pseudorandom test pattern generators.- 7.5 Test response compression.- References.- 8. Function-Specific Testing.- 8.1 Memory testing.- 8.2 Built-in testing of regular arrays.- 8.3 Testable programmable logic arrays.- References.- 9.Physical Restructuring.- 9.1 General Restructuring Techniques.- 9.2 Laser "zapping" for memory repair.- 9.3 Electronically field-programmable anti-fuses.- 9.4 Laser-assisted chemical processing.- 9.5 Focussed ion beams for restructuring.- 9.6 Electron beam restructuring.- 9.7 Restructurable VLSI program.- References.- 10. Programmable Electronic Reconfiguration Switches.- 10.1 General switching issues.- 10.2 Reconfigurable processors.- 10.3 WASP (The WAfer-scale Systolic Processor).- 10.4 Representative switch configurations.- 10.5 Non-lattice reconfiguration switch organizations.- References.- 11. Formal Models of Reconfiguration.- 11.1 Introduction.- 11.2 Probabilistic bounds: Linear arrays.- 11.3 Probabilistic bounds: 2-dimensional arrays.- 11.4 The Diogenes approach of Rosenberg.- 11.5 Self-reconfiguration algorithms.- 11.6 Spare roow/column allocation algorithms.- References.- 12. Silicon Wafer Hybrids.- 12.1 Introduction.- 12.2 Wafer transmission module.- 12.3 AVP modules.- 12.4 Programmable hybrid wafer circuits.- 12.5 MicroChannel cooling and chip attachment.- 12.6 Microwave performance issues.- 12.7 Chip Templates.- 12.8 Other Silicon Circuit Board Studies.- References.- 13. Optical Interconnections.- 13.1 optical interconnects.- 13.2 Optical Interconnect Components.- References.