Wafer Scale Integration: 1st
International Conference Proceedings
Published in June 1989
Book
Paperback/Softback
412 pages
978-0-8186-9901-6 (ISBN)
More details
Language
English
Place of publication
Los Alamitos, CA
United States
Dimensions
Height: 280 mm
ISBN-13
978-0-8186-9901-6 (9780818699016)
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