Design And Modeling For 3d Ics And Interposers
Published on 24. December 2013
Book
Hardback
380 pages
978-981-4508-59-9 (ISBN)
Description
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
More details
Series
Language
English
Place of publication
Singapore
Singapore
Target group
College/higher education
Dimensions
Height: 235 mm
Width: 157 mm
Thickness: 25 mm
Weight
700 gr
ISBN-13
978-981-4508-59-9 (9789814508599)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Content
System Integration and Modeling Concepts; Modeling of Cylindrical Interconnections; Electrical Modeling of Through Silicon Vias; Electrical Performance and Signal Integrity; Power Integrity, Return Path Discontinuities and Thermal Management.