Pad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processes
Published on 1. September 2011
Book
Paperback/Softback
332 pages
978-1-244-00937-0 (ISBN)
More details
Language
English
Place of publication
United States
Product notice
Paperback (trade)
Unsewn / adhesive bound
Illustrations
colour illustrations
Dimensions
Height: 254 mm
Width: 203 mm
Thickness: 22 mm
Weight
658 gr
ISBN-13
978-1-244-00937-0 (9781244009370)
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Schweitzer Classification