
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
Cambridge University Press
Published on 5. June 2014
Book
Paperback/Softback
472 pages
978-1-107-40986-6 (ISBN)
Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
More details
Series
Language
English
Place of publication
Cambridge
United Kingdom
Target group
College/higher education
Professional and scholarly
Product notice
Paperback (trade)
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 24 mm
Weight
630 gr
ISBN-13
978-1-107-40986-6 (9781107409866)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Editor
AT&T Bell Laboratories, New Jersey
The Johns Hopkins University
State University of New York, Buffalo
Osaka City University, Japan
Content
Part I. Metals; Part II. Organic Materials; Part III. Semiconductors; Part IV. Thin Films and Coatings; Part V. Stress-Strain and Fracture Analyses; Part VI. Reliability Issues.