Advances in Heat Transfer: Volume 50
Published on 8. November 2018
Book
Hardback
394 pages
978-0-12-815185-3 (ISBN)
Description
Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more.
More details
Series
Language
English
Place of publication
San Diego
United States
Publishing group
Elsevier Science Publishing Co Inc
Target group
Professional and scholarly
Practitioners in industry and academics teaching advanced courses
Dimensions
Height: 229 mm
Width: 152 mm
Weight
750 gr
ISBN-13
978-0-12-815185-3 (9780128151853)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Ephraim M. Sparrow | John Patrick Abraham | John M. Gorman
Advances in Heat Transfer
E-Book
11/2018
Academic Press
€155.00
Available for download
Persons
Professor Eph sparrow has practiced the art and science of heat transfer for over 60 years.He currently leads the Laboratory for Engineering Practice at the University of Minnesota. John Abraham is at University of St. Thomas, Saint Paul, MN, USA John Gorman is at University of Minnesota, Minneapolis, MN, USA
Content
1. Enhancement of Jet Impingement Heat Transfer by Means of Jet Axis Switching
John M. Gorman, Ephraim M. Sparrow, Abhimanyu Ghosh, and John P. Abraham
2. Thermal Conductivity of Carbon Nanotubes and Assemblies
Pengyingkai Wang, Rong Xiang, and Shigeo Maruyama
3. Thermal Modeling of Data Centers for Control and Energy Usage Optimization
Jayati Athavale, Minami Yoda, and Yogendra Joshi
4. Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management
Xiao-Hu Yang and Jing Liu
5. A Validated Framework for Innovation and Design Optimization of Air-to-Refrigerant Heat Exchangers
Vikrant Aute
6. Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models
Vaughan R. Voller
John M. Gorman, Ephraim M. Sparrow, Abhimanyu Ghosh, and John P. Abraham
2. Thermal Conductivity of Carbon Nanotubes and Assemblies
Pengyingkai Wang, Rong Xiang, and Shigeo Maruyama
3. Thermal Modeling of Data Centers for Control and Energy Usage Optimization
Jayati Athavale, Minami Yoda, and Yogendra Joshi
4. Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management
Xiao-Hu Yang and Jing Liu
5. A Validated Framework for Innovation and Design Optimization of Air-to-Refrigerant Heat Exchangers
Vikrant Aute
6. Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models
Vaughan R. Voller