Very Large Scale Integration Metalization Technologies
Published on 12. December 1991
Book
Hardback
505 pages
978-0-89006-501-3 (ISBN)
Description
This collection of articles presents developments in VSLI contact and connected technologies and applications. Subjects covered include opto-electronic interconnects and testing, multichip packaging and metallization reliability and multilevel metallization technologies.
More details
Series
Language
English
Place of publication
Norwood
United States
Target group
College/higher education
Professional and scholarly
Illustrations
bibliography
Dimensions
Height: 280 mm
ISBN-13
978-0-89006-501-3 (9780890065013)
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Schweitzer Classification
Content
Device and circuit interconnects - a perspective; physics and modelling of metal-semiconductor heterojunctions; metal/silicide-silicon contacts; multilevel metallization technologies; metallization of compound semiconductors; optoelectronic interconnects and testing; multichip packaging and metallization and reliability.