Component Packaging in Optoelectronics

Reviewing a critical issue for optical communications technologies, Component Packaging in Optoelectronics provides an overview of the history and current state of the art of fiber optic communications systems. This book presents a toolkit consisting of fundamental optics, fiber technology and interconnects, fundamentals of optoelectronic packaging, and optoelectronic chip fabrication. It covers common enabling components in detail, emphasizing the golden thread that relates individual photonic chip type and characteristics with packaging needs. With practical examples, this text also offers a comprehensive treatment of the state-of-the-art manufacturing processing in current use.