Wafer Scale Integration: 1st
I.F.I.P.Workshop Proceedings
Elsevier (Publisher)
Published in October 1986
Book
Hardback
378 pages
978-0-444-70103-9 (ISBN)
Description
Wafer Scale Integration (WSI) is approached from three angles in this book: proposed architectures, CAD tools, and the technology techniques required for their implementation. Some of the recent proposals for WSI architectures examined in this volume include: reconfigurable building blocks; reconfigurable microprocessors; systolic arrays for image processing; and parallel computing machines. The criteria of cost, performance and reliability are applied to these proposals in an attempt to select the best candidate for WSI. Fascinating technological advances for WSI, such as copper tracking and laser panthography, are also described. The second section examines basic software techniques useful for WSI (test, reconfiguration. general CAD). And the final section stresses the need to move away from "abstract" architectural discussions and base further effort in the real world.
Wafer Scale Integration (WSI) is approached from three angles in this book: proposed architectures, CAD tools, and the technology techniques required for their implementation. Some of the recent proposals for WSI architectures examined in this volume include: reconfigurable building blocks; reconfigurable microprocessors; systolic arrays for image processing; and parallel computing machines. The criteria of cost, performance and reliability are applied to these proposals in an attempt to select the best candidate for WSI. Fascinating technological advances for WSI, such as copper tracking and laser panthography, are also described. The second section examines basic software techniques useful for WSI (test, reconfiguration. general CAD). And the final section stresses the need to move away from "abstract" architectural discussions and base further effort in the real world.
Wafer Scale Integration (WSI) is approached from three angles in this book: proposed architectures, CAD tools, and the technology techniques required for their implementation. Some of the recent proposals for WSI architectures examined in this volume include: reconfigurable building blocks; reconfigurable microprocessors; systolic arrays for image processing; and parallel computing machines. The criteria of cost, performance and reliability are applied to these proposals in an attempt to select the best candidate for WSI. Fascinating technological advances for WSI, such as copper tracking and laser panthography, are also described. The second section examines basic software techniques useful for WSI (test, reconfiguration. general CAD). And the final section stresses the need to move away from "abstract" architectural discussions and base further effort in the real world.
More details
Language
English
Place of publication
Oxford
United Kingdom
Publishing group
Elsevier Science & Technology
Target group
College/higher education
Professional and scholarly
Illustrations
Illustrations
Dimensions
Height: 230 mm
Width: 150 mm
ISBN-13
978-0-444-70103-9 (9780444701039)
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Schweitzer Classification
Content
1. Architecture for Wafer Scale Integration. Papers by: G. Sumerling, G. Dixon and A. Stewart; P. Genestier, C. Jay and G. Saucier; F. Rhodes; R. Lea; J.P. Petrolli; Y. Ansade et al.; K. Hedlund; J.M. Pernot and J. Le Ber; S. Jones and R. Lea; J. Fried. 2. Software Techniques for Wafer Scale Integration. Papers by: C. Jay, J.P. Eynard and G. Saucier; D. Waters; M. Gruetzner; T. Leighton and C. Leiserson; F. Lombardi and D. Sciuto; R. Negrini and N. Stefanelli; J. Fried; P. Gachet, P. Quinton and P. Frison. 3. Technology for Wafer Scale Integration. Papers by: M. Katevenis and M. Blatt; G. Nicolas; L. Burns; J. Barrett, E. Smits and P. Moran; P. Girard, F.M. Roche and B. Pistoulet; R. McKirdy and R. Lea; C. Val; R. Johnson. Author Index.