
A 3D Hypoelastic Model of Rc Structure Using Lower Order Eas Elements
Lower order solid elements, Finite element approach, Three-dimensional, Enhanced assumed strain
LAP Lambert Academic Publishing
Published on 16. June 2011
Book
Paperback/Softback
260 pages
978-3-8443-3186-8 (ISBN)
Description
This investigation presents a formulation of hypo- elasticity based RC beam /frame model with bond- slip. Details of the constitutive model and analysis method used are provided. A procedure has been described to carry out three-dimensional analysis considering both geometrical as well as material nonlinearity for simply supported RC beams and substitute frames employing finite element technique, which uses 8-noded isoparametric hexahedral element HCiS18. Enhanced assumed strain (EAS) formulation has been utilized to predict load- deformation and internal stresses both in the elastic as well as nonlinear regime. It models the composite behaviour of concrete and reinforcements in rigid /perfect bond situation and their mutual interaction in bond-slip condition considering continuous interface elements at the material level. An attempt has been made to reduce the gap significantly between the results found experimentally and numerically using the proposed model and the computer code developed for the purpose. The results of the analysis are presented, discussed and compared with a few benchmark experimental results.
More details
Language
English
Place of publication
Germany
Product notice
Paperback (trade)
Unsewn / adhesive bound
Dimensions
Height: 220 mm
Width: 150 mm
Thickness: 16 mm
Weight
405 gr
ISBN-13
978-3-8443-3186-8 (9783844331868)
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Schweitzer Classification
Persons
Amiya K. Samanta : Membro da Faculdade no Departamento de Engenharia Civil da Inst. Nacional de Tecnologia Durgapur, Índia. BCE, MCE, PhD(engg.) na Jadavpur Univ desde 2001. Experiência industrial durante cerca de 7 anos. Animesh paral : Bolseiro de Investigação no Departamento de Engenharia Civil na Inst. Nacional de Tecnologia de Durgapur, Índia. BTech, MTech.