Handbook of Plasma Processing Technology
Fundamental, Etching, Deposition and Surface Interactions
Published on 31. December 1990
Book
Hardback
546 pages
978-0-8155-1220-2 (ISBN)
Description
This is a comprehensive overview of the technology of plasma-based processing, written by an outstanding group of 29 contributors.
Reviews / Votes
"The text provides and excellent reference for plasma processing." --SAMPE JournalMore details
Language
English
Place of publication
Norwich
United States
Target group
Professional and scholarly
Scientists, engineers, graduate students in the fields of semiconductors, thin films, energy, environment, automotive, medical and food packaging.
Dimensions
Height: 229 mm
Width: 152 mm
Weight
860 gr
ISBN-13
978-0-8155-1220-2 (9780815512202)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Content
Techniques for IC ProcessingIntroduction to Plasma Concepts and Discharge ConfigurationsFundamentals of Sputtering and ReflectionBombardment-Induced Compositional Changes with Alloys, Oxides, Oxysalts, and HalidesRF Diode Sputter Etching and DepositionMagnetron Plasma Deposition ProcessesBroad-Beam Ion SourceReactive Ion EtchingReactive Sputter DepositionPlasma Enhanced Chemical Vapor Deposition of Thin Films for MicroelectronicsElectron Cyclotron Resonance Microwave Discharges for Etching and Thin Film DepositionHollow Cathode Etching and DepositionIon PlatingIonized Cluster Beam (ICB) Deposition TechniquesThe Activated Reactive Evaporation (ARE) ProcessFormation of Thim Films by Remote Plasma Enhanced Chemical Vapor Deposition (Remote PECVD)Selective Bias Sputter DepositionVacuum Arc-Based ProcessingIon Source Interactions: General UnderstandingsIon Assisted DepositionMicrostructural Control of Plasma-Sputtered Refractory Coatings