Materials and Processes for Next Generation Lithography: Volume 11
Published on 18. November 2016
Book
Hardback
634 pages
978-0-08-100354-1 (ISBN)
Description
As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography.
These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches.
This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication.
These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches.
This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication.
More details
Series
Language
English
Place of publication
London
United Kingdom
Publishing group
Elsevier Health Sciences
Target group
Professional and scholarly
Lithographers, chemists and device fabricators from the Semiconductor industry, microelectromechanical systems industry, and from device and micro/nanotechnology research in academia.
Dimensions
Height: 235 mm
Width: 191 mm
Weight
1450 gr
ISBN-13
978-0-08-100354-1 (9780081003541)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
E-Book
11/2016
Elsevier
€140.00
Available for download
Persons
Dr Robinson obtained his PhD in 1999 for work on the development of materials for electron beam lithography performed at the Nanoscale Physics Research Laboratory of the University of Birmingham, and the Joint Research Center for Atom Technology in Japan. Following his PhD he investigated the modification of oxide surfaces using self-assembled monolayer, before returning to the Nanoscale Physics Research Laboratory to continue his research in lithography and microfabrication. He has recently taken up a Senior Research Fellowship in the Science City Research Alliance, based in the School of Chemical Engineering and the School of Chemistry at the Universities of Birmingham and Warwick respectively. He is currently investigating the application of advanced materials within the field of microfabrication, and the integration of functional materials with patterned substrates. Dr Lawson received his B.S. in Chemical Engineering at Tennessee Technological University in 2005. He received a Ph.D. in Chemical & Biomolecular Engineering in 2011 at the Georgia Institute of Technology where he also completed a Postdoctoral Fellowship. Since 2015, he has been at Milliken & Company where he is a Research Engineer working in the area of chemical technologies. He is an author of over 22 publications, 41 conference proceedings, and a U.S. Patent in the area of patterning materials including photoresist and block copolymer design, synthesis, and characterization along with simulation of resist processing and BCP self-assembly.
Content
1. Overview of materials and processes for lithography
2. Molecular excitation and relaxation of extreme ultraviolet lithography photoresists
3. Theory: Electron-induced chemistry
4. EUV lithography process challenges
5. EUV lithography patterning challenges
6. The chemistry and application of nonchemically amplified (non-CA) chain-scission resists
7. Chemically amplified resists and acid amplifiers
8. Negative-tone organic molecular resists
9. Positive molecular resists
10. Mainstreaming inorganic metal-oxide resists for high-resolution lithography
11. Molecular organometallic resists for EUV (MORE)
12. SML electron beam resist: Ultra-high aspect ratio nanolithography
13. Alternative resist approaches
14. Next generation lithography-the rise of unconventional methods?
15. Tip-based nanolithography methods and materials
16. Thermal scanning probe lithography
17. Scanning helium ion beam lithography
2. Molecular excitation and relaxation of extreme ultraviolet lithography photoresists
3. Theory: Electron-induced chemistry
4. EUV lithography process challenges
5. EUV lithography patterning challenges
6. The chemistry and application of nonchemically amplified (non-CA) chain-scission resists
7. Chemically amplified resists and acid amplifiers
8. Negative-tone organic molecular resists
9. Positive molecular resists
10. Mainstreaming inorganic metal-oxide resists for high-resolution lithography
11. Molecular organometallic resists for EUV (MORE)
12. SML electron beam resist: Ultra-high aspect ratio nanolithography
13. Alternative resist approaches
14. Next generation lithography-the rise of unconventional methods?
15. Tip-based nanolithography methods and materials
16. Thermal scanning probe lithography
17. Scanning helium ion beam lithography