Reliability Characterisation of Electrical and Electronic Systems

List of contributors
Woodhead Publishing Series in Electronic and Optical Materials
Foreword
1: Introduction

Abstract
1.1 Introduction
1.2 The focus of the book
1.3 Reliability science and engineering fundamentals (Chapters 2-4)
1.4 Reliability methods in component and system development (Chapters 5-9)
1.5 Reliability modelling and testing in specific applications (Chapters 10 and 11)
1.6 Conclusion


2: Reliability and stupidity: mistakes in reliability engineering and how to avoid them

Abstract
2.1 Introduction
2.2 Common mistakes in reliability engineering
2.3 Conclusion


3: Physics-of-failure (PoF) methodology for electronic reliability

Abstract
3.1 Introduction
3.2 Reliability
3.3 PoF models
3.4 PoF reliability assessment
3.5 Applications of PoF to ensure reliability
3.6 Summary and areas of future interest


4: Modern instruments for characterizing degradation in electrical and electronic equipment

Abstract
4.1 Introduction
4.2 Destructive techniques
4.3 Nondestructive techniques
4.4 In situ measurement techniques
4.5 Conclusions


5: Reliability building of discrete electronic components

Abstract
5.1 Introduction
5.2 Reliability building
5.3 Failure risks and possible corrective actions
5.4 Effect of electrostatic discharge on discrete electronic components
5.5 Conclusions


6: Reliability of optoelectronics

Abstract
6.1 Introduction
6.2 Overview of optoelectronics reliability
6.3 Approaches and recent developments
6.4 Case study: reliability of buried heterostructure (BH) InP semiconductor lasers
6.5 Reliability extrapolation and modeling
6.6 Electrostatic discharge (ESD) and electrical overstress (EOS)
6.7 Conclusions


7: Reliability of silicon integrated circuits

Abstract
Acknowledgments
7.1 Introduction
7.2 Reliability characterization approaches
7.3 Integrated circuit (IC) wear-out failure mechanisms
7.4 Summary and conclusions


8: Reliability of emerging nanodevices

Abstract
8.1 Introduction to emerging nanodevices
8.2 Material and architectural evolution of nanodevices
8.3 Failure mechanisms in nanodevices
8.4 Reliability challenges: opportunities and issues
8.5 Summary and conclusions


9: Design considerations for reliable embedded systems

Abstract
9.1 Introduction
9.2 Hardware faults
9.3 Reliable design principles
9.4 Low-cost reliable design
9.5 Future research directions
9.6 Conclusions


10: Reliability approaches for automotive electronic systems

Abstract
Acknowledgment
10.1 Introduction
10.2 Circuit reliability challenges for the automotive industry
10.3 Circuit reliability checking for the automotive industry
10.4 Using advanced electronic design automation (EDA) tools
10.5 Case studies and examples
10.6 Conclusion


11: Reliability modeling and accelerated life testing for solar power generation systems

Abstract
11.1 Introduction
11.2 Overview
11.3 Challenges
11.4 Modeling
11.5 Accelerated life testing (ALT)
11.6 ALT example: how to craft a thermal cycling ALT plan for SnAgCu (SAC) solder failure mechanism
11.7 How to craft a temperature, humidity, and bias ALT plan for CMOS metallization corrosion
11.8 Developments and opportunities
11.9 Conclusions
11.10 Sources of further information


Index