
Polymers in Microlithography
Materials and Processes
American Chemical Society (Publisher)
Published on 22. October 2002
Book
Hardback
433 pages
978-0-8412-1701-0 (ISBN)
Description
This volume examines the role polymeric materials play in the electronics industry, with special emphasis on recent advances in the science and technology of resist materials and processing for microlithography. It provides the reader with an appreciation for the diversity of chemical research efforts that are required for the development of new resist materials and processes. Its 26 chapters are divided into three sections covering chemically applied resist
chemistry, multilevel resist chemistry and processing, and novel chemistry and processes for microlithography. Each section contains an introduction written by a recognized expert in the field.
chemistry, multilevel resist chemistry and processing, and novel chemistry and processes for microlithography. Each section contains an introduction written by a recognized expert in the field.
More details
Series
Language
English
Place of publication
Washington
United States
Target group
Professional and scholarly
Dimensions
Height: 235 mm
Width: 158 mm
Thickness: 28 mm
Weight
756 gr
ISBN-13
978-0-8412-1701-0 (9780841217010)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Editor
AT&T Bell Laboratories
Almaden Research Center
Hitachi Central Research Laboratories
Content
Polymers in Microlithography: An Overview ; Bronsted Acid Generation from Triphenylsulfonium Salts in Acid-Catalyzed Photoresist Films ; Chemically Amplified Resist: Effect of Polymer and Acid Generator Structure ; Copolymer Approach to Design of Sensitive Deep-UV Resist Systems with High Thermal Stability and Dry Etch Resistance ; Nonswelling Negative Resists Incorporating Chemical Amplification: Electrophilic Aromatic Substitution Approach ; Acid-Catalyzed Cross-Linking in Phenolic-Resin-Based Negative Resists ; New Design for Self-Developing Imaging Systems Based on Thermally Labile Polyformals ; Polysilanes: Solution Photochemistry and Deep-UV Lithography ; Syntheses of Base-Soluble Si Polymers and Their Application to Resists ; Lithographic Evaluation of Phenolic Resin-Dimethyl Soloxane Block Copolymers ; Preparation of a Novel Silicone-Based Positive Photoresist and Its Application to an Image Reversal Process ; Photooxidation of Polymers: Application to Dry-Developed Single-Layer Deep-UV Resists ; Kinetics of Polymer Etching in an Oxygen Glow Discharge ; Quantitative Analysis of a Laser Interferometer Waveform Obtained During Oxygen Reactive-Ion Etching of Thin Polymer Films ; Evaluation of Several Organic Materials as Planarizing Layers for Lithographic and Etchback Processing ; New Negative Deep-UV Resist for KrF Excimer Laser Lithography ; Characterization of a Thiosulfate Funtionalized Polymer: A Water-Soluble Photosensitive Zwitterion ; Pyrimidine Derivatives as Lithographic Materials ; Synthesis of New Metal-Free Diazonium Salts and Their Applications to Microlithography ; Photobleaching Chemistry of Polymers Containing Anthracenes ; Lithography and Spectroscopy of Ultrathin Langmuir-Blodgett Polymer Films ; Dissolution of Phenolic Resins and Their Blends ; Solvent Concentration Profile of Poly(methyl methacrylate) Dissolving in Methyl Ethyl Ketone: A Fluorescence-Quenching Study ; Molecular Studies on Laser Ablation Processes of Polymeric Materials by Time-Resolved Luminescence Spectroscopy ; Mechanism of Polymer Photoablation Explored with a Quartz Crystal Microbalance ; Mechanism of UV- and VUV-Induced Etching of Poly(methyl methacrylate): Evidence for an Energy-Dependent Reaction