Advanced Metallization Conference 2003 (AMC 2003): Volume 19

The Advanced Metallization Conference (AMC) marked its twentieth anniversary in 2003. Technical leaders from around the world gather to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, vertical integration, advanced packaging and optical interconnects. In particular, presentations highlight both the advances and future challenges associated with multilevel interconnect. The latest developments in the integration of copper-based metallization with low-dielectric constant materials, and advances in the understanding of copper morphology and the reliability of the component materials of interconnect systems, are featured. Additional contributions discuss the development of advanced materials and advanced process technologies. Optimization of interconnect performance and density, and alternatives to metal-based interconnect, are addressed in papers on interconnect performance issues, vertical integration and system-in-a-package versus system-on-a-chip.
 
The Advanced Metallization Conference (AMC) marked its twentieth anniversary in 2003. Technical leaders from around the world gather to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, vertical integration, advanced packaging and optical interconnects. In particular, presentations highlight both the advances and future challenges associated with multilevel interconnect. The latest developments in the integration of copper-based metallization with low-dielectric constant materials, and advances in the understanding of copper morphology and the reliability of the component materials of interconnect systems, are featured. Additional contributions discuss the development of advanced materials and advanced process technologies. Optimization of interconnect performance and density, and alternatives to metal-based interconnect, are addressed in papers on interconnect performance issues, vertical integration and system-in-a-package versus system-on-a-chip.