Precision Assembly Technologies and Systems
7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers
Published on 3. December 2014
Book
Hardback
XII, 171 pages
978-3-662-45585-2 (ISBN)
Description
This book constitutes the refereed post-proceedings of the 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, held in Chamonix, France, in February 2014. The 20 revised full papers were carefully reviewed and selected from numerous submissions. The papers cover the following topics: micro-assembly processes and systems ranging from desktop factory automation and packaging of MEMS to self-assembly processes and platforms; handling and manipulation, including flexible gripper systems, fixturing and high precision actuators; tolerance management and error-compensation techniques applied at different scales of precision assembly; metrology and quality control; intelligent assembly control; process selection, modelling and planning.
More details
Series
Edition
2014 ed.
Language
English
Place of publication
Berlin
Germany
Publishing group
Springer Berlin
Target group
Professional and scholarly
Research
Illustrations
129 farbige Abbildungen
XII, 171 p. 129 illus. in color.
Dimensions
Height: 241 mm
Width: 160 mm
Thickness: 16 mm
Weight
448 gr
ISBN-13
978-3-662-45585-2 (9783662455852)
DOI
10.1007/978-3-662-45586-9
Schweitzer Classification
Other editions
Additional editions
Svetan Ratchev
Precision Assembly Technologies and Systems
7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers
Book
09/2016
Springer
€53.49
Shipment within 7-9 days
Svetan Ratchev
Precision Assembly Technologies and Systems
7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers
E-Book
11/2014
Springer
€53.49
Available for download
Content
Robust Adhesive Precision Bonding in Automated Assembly Cells.- Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering.- Testing the Mechanical Characteristics and Contacting Behaviour of Novel Manufactured and Assembled Sphere-Tipped Styli for Micro-CMM Probes.- Ultrasonic Press-Fitting: A New Assembly Technique.- Precision Micro Assembly of Optical Components on MID and PCB.- Integrated Tool-Chain Concept for Automated Micro-optics Assembly.- Feeding of Small Components Using the Surface Tension of Fluids.- Precision Handling of Electronic Components for PCB Rework.- Shift Dynamics of Capillary Self-Alignment.- Image Stitching Based Measurements of Medical Screws.- Concept of a Virtual Metrology Frame Based on Absolute Interferometry for Multi Robotic Assembly.- Application of Deep Belief Networks for Precision Mechanism Quality Inspection.- Visual Quality Inspection and Fine Anomalies: Methods and Application.- Control Methods in Microspheres Precision Assembly for Colloidal Lithography.- A Multi-Agent System Architecture for Self-configuration.- Process Module Construction Kit for Modular Micro Assembly Systems.- Modular Workpiece Carrier System for Micro Production.- A Generic Systems Engineering Method for Concurrent Development of Products and Manufacturing Equipment.- The SMARTLAM 3D-I Concept: Design of Microsystems from Functional Elements Fabricated by Generative Manufacturing Technologies.- Optimal Design of Remote Center Compliance Devices of Rotational Symmetry.