Digital Integrated Circuits
International Edition
2nd Edition
Published on 16. January 2003
Book
Paperback/Softback
761 pages
978-0-13-120764-6 (ISBN)
Description
Intended for use in undergraduate senior-level digital circuit design courses with advanced material sufficient for graduate-level courses.
Progressive in content and form, this text successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design. Beginning with solid discussions on the operation of electronic devices and in-depth analysis of the nucleus of digital design, the text maintains a consistent, logical flow of subject matter throughout. The revision addresses today's most significant and compelling industry topics, including: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective. The revision reflects the ongoing evolution in digital integrated circuit design, especially with respect to the impact of moving into the deep-submicron realm.
Progressive in content and form, this text successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design. Beginning with solid discussions on the operation of electronic devices and in-depth analysis of the nucleus of digital design, the text maintains a consistent, logical flow of subject matter throughout. The revision addresses today's most significant and compelling industry topics, including: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective. The revision reflects the ongoing evolution in digital integrated circuit design, especially with respect to the impact of moving into the deep-submicron realm.
More details
Edition
2nd edition
Language
English
Place of publication
United States
Publishing group
Pearson Education (US)
Target group
Professional and scholarly
Dimensions
Height: 233 mm
Width: 179 mm
Thickness: 30 mm
Weight
1140 gr
ISBN-13
978-0-13-120764-6 (9780131207646)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Previous edition
Book
01/1996
Pearson
€44.56
Article exhausted; check for reprint
Content
(NOTE: Each chapter begins with an Introduction and concludes with a Summary, To Probe Further, and Exercises and Design Problems.)I. THE FABRICS.
1. Introduction.
A Historical Perspective. Issues in Digital Integrated Circuit Design. Quality Metrics of a Digital Design.
2. The Manufacturing Process.
The CMOS Manufacturing Process. Design Rules-The Contract between Designer and Process Engineer. Packaging Integrated Circuits. Perspective-Trends in Process Technology.
3. The Devices.
The Diode. The MOS(FET) Transistor. A Word on Process Variations. Perspective: Technology Scaling.
4. The Wire.
A First Glance. Interconnect Parameters-Capitance, Resistance, and Inductance. Electrical Wire Models. SPICE Wire Models. Perspective: A Look into the Future.
II. A CIRCUIT PERSPECTIVE.
5. The CMOS Inverter.
The Static CMOS Inverter-An Intuitive Perspective. Evaluating the Robustness of the CMOS Inverter: The Static Behavior. Performance of CMOS Inverter: The Dynamic Behavior. Power, Energy, and Energy-Delay. Perspective: Technology Scaling and Its Impact on the Inverter Metrics.
6. Designing Combinational Logic Gates in CMOS.
Static CMOS Design. Dynamic CMOS Design. How to Choose a Logic Style? Perspective: Gate Design in the Ultra Deep-Submicron Era.
7. Designing Sequential Logic Circuits.
Timing Metrics for Sequential Circuits. Classification of Memory Elements. Static Latches and Registers. Dynamic Latches and Registers. Pulse Registers. Sense-Amplifier Based Registers. Pipelining: An Approach to Optimize Sequential Circuits. Non-Bistable Sequential Circuits. Perspective: Choosing a Clocking Strategy.
III. A SYSTEM PERSPECTIVE.
8. Implementation Strategies for Digital ICS.
From Custom to Semicustom and Structured-Array Design Approaches. Custom Circuit Design. Cell-Based Design Methodology. Array-Based Implementation Approaches. Perspective-The Implementation Platform of the Future.
9. Coping with Interconnect.
Capacitive Parasitics. Resistive Parasitics. Inductive Parasitics. Advanced Interconnect Techniques. Perspective: Networks-on-a-Chip.
10. Timing Issues in Digital Circuits.
Timing Classification of Digital Systems. Synchronous Design-An In-Depth Perspective. Self-Timed Circuit Design. Synchronizers and Arbiters. Clock Synthesis and Synchronization Using a Phased-Locked Loop. Future Directions and Perspectives.
11. Designing Arithmetic Building Blocks.
Datapaths in Digital Processor Architectures. The Adder. The Multiplier. The Shifter. Other Arithmetic Operators. Power and Spped Trade-Offs in Datapath Structures. Perspective: Design as a Trade-off.
12. Designing Memory and Array Structures.
The Memory Core. Memory Peripheral Circuitry. Memory Reliability and Yield. Power Dissipation in Memories. Case Studies in Memory Design. Perspective: Semiconductor Memory Trends and Evolutions.
Problem Solutions.
Index.
1. Introduction.
A Historical Perspective. Issues in Digital Integrated Circuit Design. Quality Metrics of a Digital Design.
2. The Manufacturing Process.
The CMOS Manufacturing Process. Design Rules-The Contract between Designer and Process Engineer. Packaging Integrated Circuits. Perspective-Trends in Process Technology.
3. The Devices.
The Diode. The MOS(FET) Transistor. A Word on Process Variations. Perspective: Technology Scaling.
4. The Wire.
A First Glance. Interconnect Parameters-Capitance, Resistance, and Inductance. Electrical Wire Models. SPICE Wire Models. Perspective: A Look into the Future.
II. A CIRCUIT PERSPECTIVE.
5. The CMOS Inverter.
The Static CMOS Inverter-An Intuitive Perspective. Evaluating the Robustness of the CMOS Inverter: The Static Behavior. Performance of CMOS Inverter: The Dynamic Behavior. Power, Energy, and Energy-Delay. Perspective: Technology Scaling and Its Impact on the Inverter Metrics.
6. Designing Combinational Logic Gates in CMOS.
Static CMOS Design. Dynamic CMOS Design. How to Choose a Logic Style? Perspective: Gate Design in the Ultra Deep-Submicron Era.
7. Designing Sequential Logic Circuits.
Timing Metrics for Sequential Circuits. Classification of Memory Elements. Static Latches and Registers. Dynamic Latches and Registers. Pulse Registers. Sense-Amplifier Based Registers. Pipelining: An Approach to Optimize Sequential Circuits. Non-Bistable Sequential Circuits. Perspective: Choosing a Clocking Strategy.
III. A SYSTEM PERSPECTIVE.
8. Implementation Strategies for Digital ICS.
From Custom to Semicustom and Structured-Array Design Approaches. Custom Circuit Design. Cell-Based Design Methodology. Array-Based Implementation Approaches. Perspective-The Implementation Platform of the Future.
9. Coping with Interconnect.
Capacitive Parasitics. Resistive Parasitics. Inductive Parasitics. Advanced Interconnect Techniques. Perspective: Networks-on-a-Chip.
10. Timing Issues in Digital Circuits.
Timing Classification of Digital Systems. Synchronous Design-An In-Depth Perspective. Self-Timed Circuit Design. Synchronizers and Arbiters. Clock Synthesis and Synchronization Using a Phased-Locked Loop. Future Directions and Perspectives.
11. Designing Arithmetic Building Blocks.
Datapaths in Digital Processor Architectures. The Adder. The Multiplier. The Shifter. Other Arithmetic Operators. Power and Spped Trade-Offs in Datapath Structures. Perspective: Design as a Trade-off.
12. Designing Memory and Array Structures.
The Memory Core. Memory Peripheral Circuitry. Memory Reliability and Yield. Power Dissipation in Memories. Case Studies in Memory Design. Perspective: Semiconductor Memory Trends and Evolutions.
Problem Solutions.
Index.