Handbook of Adhesive Technology, Revised and Expanded

Review topics: historical development of adhesives and adhesive bonding, Fred A. Keimel; information resources, William F. Harrington. Fundamental aspects: theories and mechanisms of adhesion, J. Schultz and M. Nardin; the mechanical theory ofadhesion, D.E. Packham; acid-base interactions - relevance to adhesion and adhesive bonding, Mohamed M. Chehimi, Ammar Azioune and Eva Cabet-Deliry; interactions of polymers in solution with surfaces, Jean-Francois Joanny; tailoring adhesion of adhesiveformulations by molecular mechanics/dynamics, A. Pizzi; principles of polymer networking and gel theory in thermosetting adhesive formulations, A. Pizzi; application of plasma technology for improved adhesion materials, Om S. Kolluri; silane and otheradhesion promoters in adhesive technology, Peter Walker; testing of adhesives, K.L. DeVries and P.R. Borgmeier; the physical testing of pressure-sensitive adhesive systems, John Johnston; durability of adhesive joints, Guy D. Davis; analysis of adhesives,David N.-S. Hon; fracture of adhesive-bonded wood joints, Bryan H. River; fracture mechanics methods for interface bond evaluations of fibre-reinforced plastic/wood hybrid composites, Julio F. Davalos and Pizhong Qiao; spectroscopic techniques in adhesivebonding, W.J. van Ooij; ultraviolet stabilization of adhesives, Douglas Horsey; thermal stabilization of adhesives, Neal J. Earhart, Ambu Patel, and Gerrit Knobloch. Adhesive classes: protein adhesives for wood, Alan L. Lambuth; animal glues andadhesives, Charles L. Pearson; carbohydrate polymers as adhesives, Melissa G.D. Baumann and Anthony H. Conner; natural rubber-based adhesives, Sadhan K. De; elastomeric adhesives, William F. Harrington; polysulfide sealants and adhesives, Naim Akmal andA.M. Usmani; phenolic resin adhesives, A. Pizzi; natural phenolic adhesives I - Tannin, A. Pizzi; natural phenolic adhesives II - lignin, A. Pizzi; resorcinol adhesives, A. Pizzi; furan-based adhesives, Mohamed Naceur Belgacem and Alessandro Gandini;urea-formaldehyde adhesives, A. Pizzi; melamine-formaldehyde adhesives, A. Pizzi; isocyanate wood binders, Charles E. Frazier; polyurethane adhesives, Dennis G. Lay and Paul Cranley; polyvinyl and ethylene-vinyl acetates, Ken Geddes; unsaturated polyesteradhesives, A. Pizzi; hot-melt adhesives, A. Pizzi; reactive acrylic adhesives, Dennis J. Damico; anaerobic adhesives, Richard D. Rich; aerobic acrylics - increasing quality and productivity with customization and adhesive/process integration, Andrew G.Bachman; technology of cyanoacrylate adhesives for industrial assembly, William G. Repensek; silicone Adhesives and sealants, Loren D. Lower and Jerome M. Klosowski; epoxy resin adhesives, T.M. Goulding; pressure-sensitive adhesives, T.M. goulding;electrically conductive adhesives, Alan M. Lyons and D. W. Dahringer. Application of adhesives: adhesives in the electronics industry, Monika Bauer and Jurgen Schneider. (Part contents).