Introduction to Electromagnetic Compatibility, Thi rd Edition
Published on 15. November 2022
Book
Hardback
912 pages
978-1-119-40434-7 (ISBN)
Description
The fully revised new edition of the classic textbook, an essential resource for anyone working with digital devices
Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design.
The extensively revised and expanded third edition reflects the most recent advances in the field as well as current U.S. and international regulatory requirements. An entirely new chapter on circuit and system grounding is complemented by updated chapters on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more.
Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations
Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves, a PSpice (R) tutorial, and computer code for calculating the per-unit length parameters and crosstalk of multiconductor transmission lines
Includes access to a companion website with SPICE examples, appendices, exercises, links to EMC resources, and supplementary information
Provides updated discussion of computer modeling tools, spectrum analyzers, EMC design strategies, and power bus design
The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.
Introduction to Electromagnetic Compatibility provides thorough coverage of the techniques and methodologies used to design and analyze electronic systems that function acceptably in their electromagnetic environment. Assuming no prior familiarity with electromagnetic compatibility, this user-friendly textbook first explains fundamental EMC concepts and technologies before moving on to more advanced topics in EMC system design.
The extensively revised and expanded third edition reflects the most recent advances in the field as well as current U.S. and international regulatory requirements. An entirely new chapter on circuit and system grounding is complemented by updated chapters on computer modeling for EMC, circuit board and system-level EMC design, EMC test practices, EMC measurement procedures and equipment, and more.
Features fully-worked examples, topic reviews, self-assessment questions, end-of-chapter exercises, and numerous high-quality images and illustrations
Contains useful appendices of phasor analysis methods, electromagnetic field equations and waves, a PSpice (R) tutorial, and computer code for calculating the per-unit length parameters and crosstalk of multiconductor transmission lines
Includes access to a companion website with SPICE examples, appendices, exercises, links to EMC resources, and supplementary information
Provides updated discussion of computer modeling tools, spectrum analyzers, EMC design strategies, and power bus design
The ideal textbook for university courses on EMC, Introduction to Electromagnetic Compatibility, Third Edition is also an invaluable reference for practicing electrical engineers dealing with interference issues or those wanting to learn more about electromagnetic compatibility to become better product designers.
More details
Edition
3rd Edition
Language
English
Place of publication
Hoboken
United States
Publishing group
John Wiley and Sons Ltd
Target group
Professional and scholarly
Dimensions
Height: 259 mm
Width: 183 mm
Thickness: 40 mm
Weight
1498 gr
ISBN-13
978-1-119-40434-7 (9781119404347)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Clayton R. Paul | Robert C. Scully | Mark A. Steffka
Introduction to Electromagnetic Compatibility
E-Book
10/2022
3rd Edition
Wiley
€116.99
Available for download
Clayton R. Paul | Robert C. Scully | Mark A. Steffka
Introduction to Electromagnetic Compatibility
E-Book
09/2022
3rd Edition
Wiley
€116.99
Available for download
Previous edition
Clayton R. Paul
Introduction to Electromagnetic Compatibility
Book
02/2006
2nd Edition
Wiley
Unfortunately, price unknown
Article exhausted; check for reprint
Person
Clayton R. Paul was Professor and Sam Nunn Chair of Aerospace Systems Engineering at Mercer University and Emeritus Professor of Electrical Engineering at the University of Kentucky, where he served on the faculty for 27 years. Dr. Paul authored twelve textbooks and published numerous technical papers in scientific journals and symposia. He was a Fellow of the IEEE and Honorary Life Member of the IEEE EMC Society.
Robert C. Scully is a Lead Engineer at the Johnson Space Center Electromagnetic Compatibility Group. He earned his PhD in Electrical Engineering from the University of Texas at Arlington, USA, and is an IEEE fellow. He supports NASA's major space programs including the International Space Station, the Multi-Purpose Crew Vehicle, and the Commercial Crew Development Program.
Mark A. Steffka is a Professor at the University of Detroit-Mercy. He joined the Electrical and Computer Engineering department as a full-time faculty member after his retirement from General Motors, where spent 20 years in the EMC Group. He received his M.S. from Indiana Wesleyan University and has over 35 years' experience in the design and development of military communication systems. Steffka is a Senior Member of the IEEE and has co-authored / authored many publications on EMC, Radio Frequency Interference and more.
Robert C. Scully is a Lead Engineer at the Johnson Space Center Electromagnetic Compatibility Group. He earned his PhD in Electrical Engineering from the University of Texas at Arlington, USA, and is an IEEE fellow. He supports NASA's major space programs including the International Space Station, the Multi-Purpose Crew Vehicle, and the Commercial Crew Development Program.
Mark A. Steffka is a Professor at the University of Detroit-Mercy. He joined the Electrical and Computer Engineering department as a full-time faculty member after his retirement from General Motors, where spent 20 years in the EMC Group. He received his M.S. from Indiana Wesleyan University and has over 35 years' experience in the design and development of military communication systems. Steffka is a Senior Member of the IEEE and has co-authored / authored many publications on EMC, Radio Frequency Interference and more.
Content
Preface
1 Introduction to Electromagnetic Compatibility (EMC)
1.1 Aspects of EMC
1.2 Electrical Dimensions and Waves
1.3 Decibels and Common EMC Units
1.3.1 Signal Source Specification
Problems
References
2 EMC Requirements for Electronic Systems
2.1 Governmental Requirements
2.1.1 Requirements for Commercial Products Marketed in the United States
2.1.2 Requirements for Commercial Products Marketed outside the United States
2.1.3 Requirements for Military Products Marketed in the United States
2.1.4 Measurement of Emissions for Verification of Compliance
2.1.4.1 Radiated Emissions
2.1.4.2 Conducted Emissions
2.1.5 Typical Product Emissions
2.1.6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits
2.2 Additional Product Requirements
2.2.1 Radiated Susceptibility (Immunity)
2.2.2 Conducted Susceptibility (Immunity)
2.2.3 Electrostatic Discharge (ESD)
2.2.4 Requirements for Commercial Aircraft
2.2.5 Requirements for Commercial Vehicles
2.3 Design Constraints for Products
2.4 Advantages of EMC Design
Problems
References
3 Signal Spectra-the Relationship between the Time Domain and the Frequency Domain
3.1 Periodic Signals
3.1.1 The Fourier Series Representation of Periodic Signals
3.1.2 Response of Linear Systems to Periodic Input Signals
3.1.3 Important Computational Techniques
3.2 Spectra of Digital Waveforms
3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms
3.2.2 Spectral Bounds for Trapezoidal Waveforms
3.2.2.1 Effect of Rise/Falltime on Spectral Content
3.2.2.2 Bandwidth of Digital Waveforms
3.2.2.3 Effect of Repetition Rate and Duty Cycle
3.2.2.4 Effect of Ringing (Undershoot/Overshoot)
3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System
3.3 Spectrum Analyzers
3.3.1 Basic Principles
3.3.2 Peak versus Quasi-Peak versus Average
3.4 Representation of Nonperiodic Waveforms
3.4.1 The Fourier Transform
3.4.2 Response of Linear Systems to Nonperiodic Inputs
3.5 Representation of Random (Data) Signals
Problems
References
4 Transmission Lines and Signal Integrity
4.1 The Transmission-Line Equations
4.2 The Per-Unit-Length Parameters
4.2.1 Wire-Type Structures
4.2.2 Printed Circuit Board (PCB) Structures
4.3 The Time-Domain Solution
4.3.1 Graphical Solutions
4.3.2 The Branin Method
4.4 High-Speed Digital Interconnects and Signal Integrity
4.4.1 Effect of Terminations on the Line Waveforms
4.4.1.1 Effect of Capacitive Terminations
4.4.1.2 Effect of Inductive Terminations
4.4.2 Matching Schemes for Signal Integrity
4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required?
4.4.4 Effects of Line Discontinuities
4.5 Sinusoidal Excitation of the Line and the Phasor Solution
4.5.1 Voltage and Current as Functions of Position
4.5.2 Power Flow
4.5.3 Inclusion of Losses
4.5.4 Effect of Losses on Signal Integrity
4.6 Lumped-Circuit Approximate Models
Problems
References
5 Nonideal Behavior of Components
5.1 Wires
5.1.1 Resistance and Internal Inductance of Wires
5.1.2 External Inductance and Capacitance of Parallel Wires
5.1.3 Lumped Equivalent Circuits of Parallel Wires
5.2 Printed Circuit Board (PCB) Lands
5.3 Effect of Component Leads
5.4 Resistors
5.5 Capacitors
5.6 Inductors
5.7 Ferromagnetic Materials-Saturation and Frequency Response
5.8 Ferrite Beads
5.9 Common-Mode Chokes
5.10 Electromechanical Devices
5.10.1 DC Motors
5.10.2 Stepper Motors
5.10.3 AC Motors
5.10.4 Solenoids
5.11 Digital Circuit Devices
5.12 Effect of Component Variability
5.13 Mechanical Switches
5.13.1 Arcing at Switch Contacts
5.13.2 The Showering Arc
5.13.3 Arc Suppression
Problems
References
6 Conducted Emissions and Susceptibility
6.1 Measurement of Conducted Emissions
6.1.1 The Line Impedance Stabilization Network (LISN)
6.1.2 Common- and Differential-Mode Currents Again
6.2 Power Supply Filters
6.2.1 Basic Properties of Filters
6.2.2 A Generic Power Supply Filter Topology
6.2.3 Effect of Filter Elements on Common- and Differential-Mode Currents
6.2.4 Separation of Conducted Emissions into Common and Differential-Mode
Components for Diagnostic Purposes
6.3 Power Supplies
6.3.1 Linear Power Supplies
6.3.2 Switched-Mode Power Supplies (SMPS)
6.3.3 Effect of Power Supply Components on Conducted Emissions
6.4 Power Supply and Filter Placement
6.5 Conducted Susceptibility
Problems
References
7 Antennas
7.1 Elemental Dipole Antennas
7.1.1 The Electric (Hertzian) Dipole
7.1.2 The Magnetic Dipole (Loop)
7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas
7.3 Antenna Arrays
7.4 Characterization of Antennas
7.4.1 Directivity and Gain
7.4.2 Effective Aperture
7.4.3 Antenna Factor
7.4.4 Effects of Balancing and Baluns
7.4.5 Impedance Matching and the Use of Pads
7.5 The Friis Transmission Equation
7.6 Effects of Reflections
7.6.1 The Method of Images
7.6.2 Normal Incidence of Uniform Plane Waves on Plane Material Boundaries
7.6.3 Multipath Effects
7.7 Broadband Measurement Antennas
7.7.1 The Biconical Antenna
7.7.2 The Log-Periodic Antenna
7.8 Antenna Modeling and Simulation
7.8.1 Why Model Antennas?
7.8.2 Modeling Methods
7.8.3 Summary
Problems
References
8 Radiated Emissions and Susceptibility
8.1 Simple Emission Models for Wires and PCB Lands
8.1.1 Differential-Mode versus Common-Mode Currents
8.1.2 Differential-Mode Current Emission Model
8.1.3 Common-Mode Current Emission Model
8.1.4 Current Probes
8.1.5 Experimental Results
8.2 Simple Susceptibility Models for Wires and PCB Lands
8.2.1 Experimental Results
8.2.2 Shielded Cables and Surface Transfer Impedance
Problems
References
9 Crosstalk
9.1 Three-Conductor Transmission Lines and Crosstalk
9.2 The Transmission-Line Equations for Lossless Lines
9.3 The Per-Unit-Length Parameters
9.3.1 Homogeneous versus Inhomogeneous Media
9.3.2 Wide-Separation Approximations for Wires
9.3.3 Numerical Methods for Other Structures
9.3.3.1 Wires with Dielectric Insulations (Ribbon Cables)
9.3.3.2 Rectangular Cross-Section Conductors (PCB Lands)
9.4 The Inductive-Capacitive Coupling Approximate Model
9.4.1 Frequency-Domain Inductive-Capacitive Coupling Model
9.4.1.1 Inclusion of Losses: Common-Impedance Coupling
9.4.1.2 Experimental Results
9.4.2 Time-Domain Inductive-Capacitive Coupling Model
9.4.2.1 Inclusion of Losses: Common-Impedance Coupling
9.4.2.2 Experimental Results
9.5 Shielded Wires
9.5.1 Per-Unit-Length Parameters
9.5.2 Inductive and Capacitive Coupling
9.5.3 Effect of Shield Grounding
9.5.4 Effect of Pigtails
9.5.5 Effects of Multiple Shields
9.5.6 MTL Model Predictions
9.6 Twisted Wires
9.6.1 Per-Unit-Length Parameters
9.6.2 Inductive and Capacitive Coupling
9.6.3 Effects of Twist
9.6.4 Effects of Balancing
Problems
References
10 Shielding
10.1 Shielding Effectiveness
10.2 Shielding Effectiveness: Far-Field Sources
10.2.1 Exact Solution
10.2.2 Approximate Solution
10.2.2.1 Reflection Loss
10.2.2.2 Absorption Loss
10.2.2.3 Multiple-Reflection Loss
10.2.2.4 Total Loss
10.3 Shielding Effectiveness: Near-Field Sources
10.3.1 Near Field versus Far Field
10.3.2 Electric Sources
10.3.3 Magnetic Sources
10.4 Low-Frequency, Magnetic Field Shielding
10.5 Effect of Apertures
Problems
References
11 System Design for EMC
11.1 Changing the Way We Think about Electrical Phenomena
11.1.1 Nonideal Behavior of Components and the Hidden Schematic
11.1.2 "Electrons Do Not Read Schematics"
11.1.3 What Do We Mean by the Term "Shielding"?
11.2 What Do We Mean by the Term "Ground"?
11.2.1 Safety Ground
11.2.2 Signal Ground
11.2.3 Ground Bounce and Partial Inductance
11.2.3.1 Partial Inductance of Wires
11.2.3.2 Partial Inductance of PCB Lands
11.2.4 Currents Return to Their Source on the Paths of Lowest Impedance
11.2.5 Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path
11.2.6 Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding
11.2.7 Ground Loops and Subsystem Decoupling
11.3 Printed Circuit Board (PCB) Design
11.3.1 Component Selection
11.3.2 Component Speed and Placement
11.3.3 Cable I/O Placement and Filtering
11.3.4 The Important Ground Grid
11.3.5 Power Distribution and Decoupling Capacitors
11.3.6 Reduction of Loop Areas
11.3.7 Mixed-Signal PCB Partitioning
11.4 System Configuration and Design
11.4.1 System Enclosures
11.4.2 Power Line Filter Placement
11.4.3 Interconnection and Number of Printed Circuit Boards
11.4.4 Internal Cable Routing and Connector Placement
11.4.5 PCB and Subsystem Placement
11.4.6 PCB and Subsystem Decoupling
11.4.7 Motor Noise Suppression
11.4.8 Electrostatic Discharge (ESD)
11.5 Diagnostic Tools
11.5.1 The Concept of Dominant Effect in the Diagnosis of EMC Problems
Problems
References
Appendix A The Phasor Solution Method
A.1 Solving Differential Equations for Their Sinusoidal Steady-State Solution
A.2 Solving Electric Circuits for Their Sinusoidal Steady-State Response
Problems
References
Appendix B The Electromagnetic Field Equations and Waves
B.1 Vector Analysis
B.2 Maxwell's Equations
B.2.1 Faraday's Law
B.2.2 Ampere's Law
B.2.3 Gauss' Laws
B.2.4 Conservation of Charge
B.2.5 Constitutive Parameters of the Medium
B.3 Boundary Conditions
B.4 Sinusoidal Steady State
B.5 Power Flow
B.6 Uniform Plane Waves
B.6.1 Lossless Media
B.6.2 Lossy Media
B.6.3 Power Flow
B.6.4 Conductors versus Dielectrics
B.6.5 Skin Depth
B.7 Static (DC) Electromagnetic Field Relations - a Special Case
B.7.1 Maxwell's Equations for Static (DC) Fields
B.7.1.1 Range of Applicability for Low-Frequency Fields
B.7.2 Two-Dimensional Fields and Laplace's Equation
Problems
References
Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines
C.1 WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires
C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables
C.3 PCB.FOR for Computing the PUL Parameter Matrices of Printed Circuit Boards
C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines
C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines
Appendix D A SPICE (PSPICE, LTSPICE, ETC) Tutorial and Applications Guide
D.1 Creating the SPICE or PSPICE Simulation
D.1.1 Circuit Description
D.1.2 Execution Statements
D.1.3 Output Statements
D.1.4 Examples
D.2 Creating an LTSPICE Simulation
D.3 Lumped-Circuit Approximate Models
D.4 An Exact SPICE (PSPICE) Model for Lossless Coupled Lines
D.4.1 Computed versus Experimental Results for Wires
D.4.2 Computed versus Experimental Results for PCBs
D.5 Use of SPICE (PSPICE) for Fourier Analysis
D.6 SPICEMTL.FOR for Computing a SPICE (PSPICE) Subcircuit Model of a Lossless, Multiconductor Transmission Line
D.7 SPICELPI.FOR For Computing a SPICE (PSPICE) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line
Problems
References
Appendix E A Brief History of EMC
E.1 History of EMC
E.2 Historical Examples
References
Index
1 Introduction to Electromagnetic Compatibility (EMC)
1.1 Aspects of EMC
1.2 Electrical Dimensions and Waves
1.3 Decibels and Common EMC Units
1.3.1 Signal Source Specification
Problems
References
2 EMC Requirements for Electronic Systems
2.1 Governmental Requirements
2.1.1 Requirements for Commercial Products Marketed in the United States
2.1.2 Requirements for Commercial Products Marketed outside the United States
2.1.3 Requirements for Military Products Marketed in the United States
2.1.4 Measurement of Emissions for Verification of Compliance
2.1.4.1 Radiated Emissions
2.1.4.2 Conducted Emissions
2.1.5 Typical Product Emissions
2.1.6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits
2.2 Additional Product Requirements
2.2.1 Radiated Susceptibility (Immunity)
2.2.2 Conducted Susceptibility (Immunity)
2.2.3 Electrostatic Discharge (ESD)
2.2.4 Requirements for Commercial Aircraft
2.2.5 Requirements for Commercial Vehicles
2.3 Design Constraints for Products
2.4 Advantages of EMC Design
Problems
References
3 Signal Spectra-the Relationship between the Time Domain and the Frequency Domain
3.1 Periodic Signals
3.1.1 The Fourier Series Representation of Periodic Signals
3.1.2 Response of Linear Systems to Periodic Input Signals
3.1.3 Important Computational Techniques
3.2 Spectra of Digital Waveforms
3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms
3.2.2 Spectral Bounds for Trapezoidal Waveforms
3.2.2.1 Effect of Rise/Falltime on Spectral Content
3.2.2.2 Bandwidth of Digital Waveforms
3.2.2.3 Effect of Repetition Rate and Duty Cycle
3.2.2.4 Effect of Ringing (Undershoot/Overshoot)
3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System
3.3 Spectrum Analyzers
3.3.1 Basic Principles
3.3.2 Peak versus Quasi-Peak versus Average
3.4 Representation of Nonperiodic Waveforms
3.4.1 The Fourier Transform
3.4.2 Response of Linear Systems to Nonperiodic Inputs
3.5 Representation of Random (Data) Signals
Problems
References
4 Transmission Lines and Signal Integrity
4.1 The Transmission-Line Equations
4.2 The Per-Unit-Length Parameters
4.2.1 Wire-Type Structures
4.2.2 Printed Circuit Board (PCB) Structures
4.3 The Time-Domain Solution
4.3.1 Graphical Solutions
4.3.2 The Branin Method
4.4 High-Speed Digital Interconnects and Signal Integrity
4.4.1 Effect of Terminations on the Line Waveforms
4.4.1.1 Effect of Capacitive Terminations
4.4.1.2 Effect of Inductive Terminations
4.4.2 Matching Schemes for Signal Integrity
4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required?
4.4.4 Effects of Line Discontinuities
4.5 Sinusoidal Excitation of the Line and the Phasor Solution
4.5.1 Voltage and Current as Functions of Position
4.5.2 Power Flow
4.5.3 Inclusion of Losses
4.5.4 Effect of Losses on Signal Integrity
4.6 Lumped-Circuit Approximate Models
Problems
References
5 Nonideal Behavior of Components
5.1 Wires
5.1.1 Resistance and Internal Inductance of Wires
5.1.2 External Inductance and Capacitance of Parallel Wires
5.1.3 Lumped Equivalent Circuits of Parallel Wires
5.2 Printed Circuit Board (PCB) Lands
5.3 Effect of Component Leads
5.4 Resistors
5.5 Capacitors
5.6 Inductors
5.7 Ferromagnetic Materials-Saturation and Frequency Response
5.8 Ferrite Beads
5.9 Common-Mode Chokes
5.10 Electromechanical Devices
5.10.1 DC Motors
5.10.2 Stepper Motors
5.10.3 AC Motors
5.10.4 Solenoids
5.11 Digital Circuit Devices
5.12 Effect of Component Variability
5.13 Mechanical Switches
5.13.1 Arcing at Switch Contacts
5.13.2 The Showering Arc
5.13.3 Arc Suppression
Problems
References
6 Conducted Emissions and Susceptibility
6.1 Measurement of Conducted Emissions
6.1.1 The Line Impedance Stabilization Network (LISN)
6.1.2 Common- and Differential-Mode Currents Again
6.2 Power Supply Filters
6.2.1 Basic Properties of Filters
6.2.2 A Generic Power Supply Filter Topology
6.2.3 Effect of Filter Elements on Common- and Differential-Mode Currents
6.2.4 Separation of Conducted Emissions into Common and Differential-Mode
Components for Diagnostic Purposes
6.3 Power Supplies
6.3.1 Linear Power Supplies
6.3.2 Switched-Mode Power Supplies (SMPS)
6.3.3 Effect of Power Supply Components on Conducted Emissions
6.4 Power Supply and Filter Placement
6.5 Conducted Susceptibility
Problems
References
7 Antennas
7.1 Elemental Dipole Antennas
7.1.1 The Electric (Hertzian) Dipole
7.1.2 The Magnetic Dipole (Loop)
7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas
7.3 Antenna Arrays
7.4 Characterization of Antennas
7.4.1 Directivity and Gain
7.4.2 Effective Aperture
7.4.3 Antenna Factor
7.4.4 Effects of Balancing and Baluns
7.4.5 Impedance Matching and the Use of Pads
7.5 The Friis Transmission Equation
7.6 Effects of Reflections
7.6.1 The Method of Images
7.6.2 Normal Incidence of Uniform Plane Waves on Plane Material Boundaries
7.6.3 Multipath Effects
7.7 Broadband Measurement Antennas
7.7.1 The Biconical Antenna
7.7.2 The Log-Periodic Antenna
7.8 Antenna Modeling and Simulation
7.8.1 Why Model Antennas?
7.8.2 Modeling Methods
7.8.3 Summary
Problems
References
8 Radiated Emissions and Susceptibility
8.1 Simple Emission Models for Wires and PCB Lands
8.1.1 Differential-Mode versus Common-Mode Currents
8.1.2 Differential-Mode Current Emission Model
8.1.3 Common-Mode Current Emission Model
8.1.4 Current Probes
8.1.5 Experimental Results
8.2 Simple Susceptibility Models for Wires and PCB Lands
8.2.1 Experimental Results
8.2.2 Shielded Cables and Surface Transfer Impedance
Problems
References
9 Crosstalk
9.1 Three-Conductor Transmission Lines and Crosstalk
9.2 The Transmission-Line Equations for Lossless Lines
9.3 The Per-Unit-Length Parameters
9.3.1 Homogeneous versus Inhomogeneous Media
9.3.2 Wide-Separation Approximations for Wires
9.3.3 Numerical Methods for Other Structures
9.3.3.1 Wires with Dielectric Insulations (Ribbon Cables)
9.3.3.2 Rectangular Cross-Section Conductors (PCB Lands)
9.4 The Inductive-Capacitive Coupling Approximate Model
9.4.1 Frequency-Domain Inductive-Capacitive Coupling Model
9.4.1.1 Inclusion of Losses: Common-Impedance Coupling
9.4.1.2 Experimental Results
9.4.2 Time-Domain Inductive-Capacitive Coupling Model
9.4.2.1 Inclusion of Losses: Common-Impedance Coupling
9.4.2.2 Experimental Results
9.5 Shielded Wires
9.5.1 Per-Unit-Length Parameters
9.5.2 Inductive and Capacitive Coupling
9.5.3 Effect of Shield Grounding
9.5.4 Effect of Pigtails
9.5.5 Effects of Multiple Shields
9.5.6 MTL Model Predictions
9.6 Twisted Wires
9.6.1 Per-Unit-Length Parameters
9.6.2 Inductive and Capacitive Coupling
9.6.3 Effects of Twist
9.6.4 Effects of Balancing
Problems
References
10 Shielding
10.1 Shielding Effectiveness
10.2 Shielding Effectiveness: Far-Field Sources
10.2.1 Exact Solution
10.2.2 Approximate Solution
10.2.2.1 Reflection Loss
10.2.2.2 Absorption Loss
10.2.2.3 Multiple-Reflection Loss
10.2.2.4 Total Loss
10.3 Shielding Effectiveness: Near-Field Sources
10.3.1 Near Field versus Far Field
10.3.2 Electric Sources
10.3.3 Magnetic Sources
10.4 Low-Frequency, Magnetic Field Shielding
10.5 Effect of Apertures
Problems
References
11 System Design for EMC
11.1 Changing the Way We Think about Electrical Phenomena
11.1.1 Nonideal Behavior of Components and the Hidden Schematic
11.1.2 "Electrons Do Not Read Schematics"
11.1.3 What Do We Mean by the Term "Shielding"?
11.2 What Do We Mean by the Term "Ground"?
11.2.1 Safety Ground
11.2.2 Signal Ground
11.2.3 Ground Bounce and Partial Inductance
11.2.3.1 Partial Inductance of Wires
11.2.3.2 Partial Inductance of PCB Lands
11.2.4 Currents Return to Their Source on the Paths of Lowest Impedance
11.2.5 Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path
11.2.6 Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding
11.2.7 Ground Loops and Subsystem Decoupling
11.3 Printed Circuit Board (PCB) Design
11.3.1 Component Selection
11.3.2 Component Speed and Placement
11.3.3 Cable I/O Placement and Filtering
11.3.4 The Important Ground Grid
11.3.5 Power Distribution and Decoupling Capacitors
11.3.6 Reduction of Loop Areas
11.3.7 Mixed-Signal PCB Partitioning
11.4 System Configuration and Design
11.4.1 System Enclosures
11.4.2 Power Line Filter Placement
11.4.3 Interconnection and Number of Printed Circuit Boards
11.4.4 Internal Cable Routing and Connector Placement
11.4.5 PCB and Subsystem Placement
11.4.6 PCB and Subsystem Decoupling
11.4.7 Motor Noise Suppression
11.4.8 Electrostatic Discharge (ESD)
11.5 Diagnostic Tools
11.5.1 The Concept of Dominant Effect in the Diagnosis of EMC Problems
Problems
References
Appendix A The Phasor Solution Method
A.1 Solving Differential Equations for Their Sinusoidal Steady-State Solution
A.2 Solving Electric Circuits for Their Sinusoidal Steady-State Response
Problems
References
Appendix B The Electromagnetic Field Equations and Waves
B.1 Vector Analysis
B.2 Maxwell's Equations
B.2.1 Faraday's Law
B.2.2 Ampere's Law
B.2.3 Gauss' Laws
B.2.4 Conservation of Charge
B.2.5 Constitutive Parameters of the Medium
B.3 Boundary Conditions
B.4 Sinusoidal Steady State
B.5 Power Flow
B.6 Uniform Plane Waves
B.6.1 Lossless Media
B.6.2 Lossy Media
B.6.3 Power Flow
B.6.4 Conductors versus Dielectrics
B.6.5 Skin Depth
B.7 Static (DC) Electromagnetic Field Relations - a Special Case
B.7.1 Maxwell's Equations for Static (DC) Fields
B.7.1.1 Range of Applicability for Low-Frequency Fields
B.7.2 Two-Dimensional Fields and Laplace's Equation
Problems
References
Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines
C.1 WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires
C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables
C.3 PCB.FOR for Computing the PUL Parameter Matrices of Printed Circuit Boards
C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines
C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines
Appendix D A SPICE (PSPICE, LTSPICE, ETC) Tutorial and Applications Guide
D.1 Creating the SPICE or PSPICE Simulation
D.1.1 Circuit Description
D.1.2 Execution Statements
D.1.3 Output Statements
D.1.4 Examples
D.2 Creating an LTSPICE Simulation
D.3 Lumped-Circuit Approximate Models
D.4 An Exact SPICE (PSPICE) Model for Lossless Coupled Lines
D.4.1 Computed versus Experimental Results for Wires
D.4.2 Computed versus Experimental Results for PCBs
D.5 Use of SPICE (PSPICE) for Fourier Analysis
D.6 SPICEMTL.FOR for Computing a SPICE (PSPICE) Subcircuit Model of a Lossless, Multiconductor Transmission Line
D.7 SPICELPI.FOR For Computing a SPICE (PSPICE) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line
Problems
References
Appendix E A Brief History of EMC
E.1 History of EMC
E.2 Historical Examples
References
Index