Optical Inspection of Microsystems
1st Edition
Published on 20. July 2006
Book
Hardback
503 pages
978-0-8493-3682-9 (ISBN)
Description
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.
Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.
Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.
Reviews / Votes
"The editor of this book has been working in the field of optical metrology for most of his career, so it is no surprise that he has edited a well-balanced and up-to-date picture of the most important optical measurement techniques used for microcomponents inspections. The book describes the basic principles of image correlation, light scattering, atomic force microscopy, moire methods, grating interferometry, interference microscopy, laser Doppler vibrometry, digital holography, speckle metrology, and spectroscopic techniques, and also their major application for Microsystems testing. ... Each chapter includes a reasonable number of references. This book is a welcome addition to the literature on optical inspection. It is an excellent value for any graduate student, application engineer, research laboratory and group working in this field, and also for those who are contemplating using these techniques to solve a specific problem."- Guillermo H. Kaufmann, Instituto de Fisica Rosario, Argentina, in OPN Optics & Photonics News, Vol. 18, No.3, March 2007
More details
Language
English
Place of publication
Bosa Roca
United States
Publishing group
Taylor & Francis Inc
Target group
Professional and scholarly
Designers and users of MEMS, electrical, optical, and mechanical engineering, quality assurance and control specialists, physicists and students of engineering and natural sciences.
Illustrations
479 s/w Abbildungen, 23 s/w Tabellen, 230 s/w Photographien bzw. Rasterbilder
375 equations; 230 Halftones, black and white; 23 Tables, black and white; 479 Illustrations, black and white
Dimensions
Height: 254 mm
Width: 178 mm
Weight
1089 gr
ISBN-13
978-0-8493-3682-9 (9780849336829)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
New editions
Wolfgang Osten
Optical Inspection of Microsystems, Second Edition
Book
06/2019
2nd Edition
CRC Press
€355.10
Shipment within 15-20 days
Additional editions
Wolfgang Osten
Optical Inspection of Microsystems
Book
10/2019
1st Edition
CRC Press
€67.80
Shipment within 15-20 days
Persons
Osten, Wolfgang
Content
Image Processing and Computer Vision for MEMS Testing; Markus Huettel
Introduction
Classification of Tasks
Image Processing and Computer Vision Components
Processing and Analysis of Image Data
Commercial and Noncommercial Image Processing and Computer Vision Software
Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology
Conclusion
References
Image Correlation Techniques for Microsystems Inspection; Dietmar Vogel and Bernd Michel
Introduction
Deformation Measurement by Digital Image Correlation (DIC) Techniques
Base Equipment for DIC Applications
Applications of DIC Techniques to Microsystems
Conclusions and Outlook
References
Light Scattering Techniques for the Inspection of Microcomponents and Microstructures; Angela Duparre
Introduction
Theoretical Background of Light Scattering
Measurement Equipment
Standardization of Light Scattering Methods
Applications for Microcomponent and Microstructure Inspection
Combination of Light Scattering and Profilometric Techniques
Conclusions and Outlook
References
Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM); F. Michael Serry and Joanna Schmit
Introduction
Components of AFM and Principles of AFM Operation
AFM Imaging Modes
AFM Nonimaging Modes
Applications of AFM for Microcomponent Inspection: A Case Study
Atomic Force Profilometer (AFP) - A Combination of AFM and Stylus Profiler
Optical Metrology Complementary to AFM
Conclusions and Outlook
References
Optical Profiling Techniques for MEMS Measurement; Klaus Koerner, Aiko Ruprecht, and Tobias Wiesendanger
Introduction
Principles of Confocal Microscopy
Principle of Microscopic Depth-Scanning Fringe Projection (DSFP)
Conclusion
References
Grid and Moire Methods for Micromeasurements; Anand Asundi, Bing Zhao, and Huimin Xie
Introduction
Grid or Grating Fabrication Methods
Micro-Moire Interferometer
Moire Methods Using High-Resolution Microscopy
Microscopic Grid Methods
Conclusions
References
Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents; Leszek Salbut
Introduction
Principle of Grating Interferometry
Waveguide Grating Interferometry
Measurement System
SG Technology
Exemplary Applications of WGI
Conclusions
References
Interference Microscopy Techniques for Microsystem Characterization; Alain Bosseboeuf and Sylvain Petitgrand
Introduction
Interference Microscopes
Modeling of Two-Beam Homodyne Interference Microscopes
Static Measurements by Interference Microscopy
Performance and Issues of Interference Microscopy
Applications of Interferometric Profilometers in the MEMS Field
Dynamic Measurements by Interference Microscopy
Conclusion
Acknowledgments
References
Measuring MEMS in Motion by Laser Doppler Vibrometry; Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Woertge
Introduction
Laser Doppler Effect and Its Interferometric Detection
Techniques of Laser Doppler Vibrometry
Full-Field Vibrometry
Measuring on Microscopic Structures
Resolution and Accuracy
Combination with Other Techniques
Examples
Conclusion and Outlook
References
An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS; Christophe Gorecki, Michal Jozwik, and Patrick Delobelle
Introduction
Interferometric Platform Architecture and Principle of Operation
Optomechanical Characterization of Membranes by "Pointwise" Deflection Method
Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements
Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique
General Conclusion and Outlook
Acknowledgments
References
Optoelectronic Holography for Testing Electronic Packaging and MEMS; Cosme Furlong
Introduction
Overview of MEMS Fabrication Processes
Optoelectronic Holography
Representative Applications
Summary
Acknowledgments
References
Digital Holography and Its Application in MEMS/MOEMS Inspection; Wolfgang Osten and Pietro Ferraro
Introduction
Theory and Basic Principle of Digital Holography (DH)
Digital Holographic Interferometry
Digital Holographic Microscopy (DHM)
The Application of DH to the Investigation of Microcomponents
Conclusion
References
Speckle Metrology for Microsystem Inspection; Roland Hoefling and Petra Aswendt
Introduction
Basics
Applications
Conclusion
References
Spectroscopic Techniques for MEMS Inspection; Ingrid De Wolf
Introduction
Raman Spectroscopy (RS)
Spectroscopic Ellipsometry (SE)
Dual-Beam Spectroscopy (DBS)
X-Ray Photoelectron Spectroscopy (XPS)
High-Resolution Electron Energy Loss Spectroscopy (HREELS)
Auger Electron Spectroscopy (AES)
Brillouin Scattering (BS)
Conclusions
References
Index
Introduction
Classification of Tasks
Image Processing and Computer Vision Components
Processing and Analysis of Image Data
Commercial and Noncommercial Image Processing and Computer Vision Software
Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology
Conclusion
References
Image Correlation Techniques for Microsystems Inspection; Dietmar Vogel and Bernd Michel
Introduction
Deformation Measurement by Digital Image Correlation (DIC) Techniques
Base Equipment for DIC Applications
Applications of DIC Techniques to Microsystems
Conclusions and Outlook
References
Light Scattering Techniques for the Inspection of Microcomponents and Microstructures; Angela Duparre
Introduction
Theoretical Background of Light Scattering
Measurement Equipment
Standardization of Light Scattering Methods
Applications for Microcomponent and Microstructure Inspection
Combination of Light Scattering and Profilometric Techniques
Conclusions and Outlook
References
Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM); F. Michael Serry and Joanna Schmit
Introduction
Components of AFM and Principles of AFM Operation
AFM Imaging Modes
AFM Nonimaging Modes
Applications of AFM for Microcomponent Inspection: A Case Study
Atomic Force Profilometer (AFP) - A Combination of AFM and Stylus Profiler
Optical Metrology Complementary to AFM
Conclusions and Outlook
References
Optical Profiling Techniques for MEMS Measurement; Klaus Koerner, Aiko Ruprecht, and Tobias Wiesendanger
Introduction
Principles of Confocal Microscopy
Principle of Microscopic Depth-Scanning Fringe Projection (DSFP)
Conclusion
References
Grid and Moire Methods for Micromeasurements; Anand Asundi, Bing Zhao, and Huimin Xie
Introduction
Grid or Grating Fabrication Methods
Micro-Moire Interferometer
Moire Methods Using High-Resolution Microscopy
Microscopic Grid Methods
Conclusions
References
Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents; Leszek Salbut
Introduction
Principle of Grating Interferometry
Waveguide Grating Interferometry
Measurement System
SG Technology
Exemplary Applications of WGI
Conclusions
References
Interference Microscopy Techniques for Microsystem Characterization; Alain Bosseboeuf and Sylvain Petitgrand
Introduction
Interference Microscopes
Modeling of Two-Beam Homodyne Interference Microscopes
Static Measurements by Interference Microscopy
Performance and Issues of Interference Microscopy
Applications of Interferometric Profilometers in the MEMS Field
Dynamic Measurements by Interference Microscopy
Conclusion
Acknowledgments
References
Measuring MEMS in Motion by Laser Doppler Vibrometry; Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Woertge
Introduction
Laser Doppler Effect and Its Interferometric Detection
Techniques of Laser Doppler Vibrometry
Full-Field Vibrometry
Measuring on Microscopic Structures
Resolution and Accuracy
Combination with Other Techniques
Examples
Conclusion and Outlook
References
An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS; Christophe Gorecki, Michal Jozwik, and Patrick Delobelle
Introduction
Interferometric Platform Architecture and Principle of Operation
Optomechanical Characterization of Membranes by "Pointwise" Deflection Method
Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements
Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique
General Conclusion and Outlook
Acknowledgments
References
Optoelectronic Holography for Testing Electronic Packaging and MEMS; Cosme Furlong
Introduction
Overview of MEMS Fabrication Processes
Optoelectronic Holography
Representative Applications
Summary
Acknowledgments
References
Digital Holography and Its Application in MEMS/MOEMS Inspection; Wolfgang Osten and Pietro Ferraro
Introduction
Theory and Basic Principle of Digital Holography (DH)
Digital Holographic Interferometry
Digital Holographic Microscopy (DHM)
The Application of DH to the Investigation of Microcomponents
Conclusion
References
Speckle Metrology for Microsystem Inspection; Roland Hoefling and Petra Aswendt
Introduction
Basics
Applications
Conclusion
References
Spectroscopic Techniques for MEMS Inspection; Ingrid De Wolf
Introduction
Raman Spectroscopy (RS)
Spectroscopic Ellipsometry (SE)
Dual-Beam Spectroscopy (DBS)
X-Ray Photoelectron Spectroscopy (XPS)
High-Resolution Electron Energy Loss Spectroscopy (HREELS)
Auger Electron Spectroscopy (AES)
Brillouin Scattering (BS)
Conclusions
References
Index