
Reliability and Failure of Electronic Materials and Devices
Academic Press
2nd Edition
Published on 30. October 2018
Book
Paperback/Softback
758 pages
978-0-12-810036-3 (ISBN)
Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
More details
Edition
2nd edition
Language
English
Place of publication
San Diego
United States
Publishing group
Elsevier Science Publishing Co Inc
Target group
Professional and scholarly
Professional Materials Engineers working with materials used in electronic devices, including silicon chips; Electronics Engineers; Electrical Engineers; Manufacturing Engineers; Chemical Engineers
Dimensions
Height: 229 mm
Width: 152 mm
ISBN-13
978-0-12-810036-3 (9780128100363)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

Milton Ohring | Lucian Kasprzak
Reliability and Failure of Electronic Materials and Devices
Book
10/2014
2nd Edition
Academic Press
€136.50
Shipment within 15-20 days
Previous edition

Book
06/1998
Academic Press
€161.50
Shipment within 15-20 days
Persons
Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise. In 1988, Dr Lucian Kasprzak became an IEEE Fellow "For contributions to very-largescale-integrated devices through the integration of reliability physics with process development.? He discovered the hot-electron effect in short channel field-effect transistors, while at IBM in 1973. From 1992 to 1996, he was Associate Professor of Physics and Engineering Science at Franciscan University. He retired from IBM in 1995 after 30 years. In 1996, he joined Sterling Diagnostic Imaging as Reliability Manager for the Direct Radiography Program. He became Director of Reliability at Direct Radiography Corp. in 1997. Early in 2001 he became an independent Reliability Consultant.
Author
Stevens Institute of Technology, Hoboken, NJ, USA (Retired)
Siemens Healthcare Diagnostics (Retired)
Content
1. An Overview of Electronic Devices and Their Reliability
2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
3. Defects, Contamination and Yield
4. The Mathematics of Failure and Reliability
5. Mass Transport-Induced Failure
6. Electronic Charge-Induced Damage
7. Environmental Damage to Electronic Products
8. Packaging Materials, Processes, and Stresses
9. Degradation of Contacts and Packages
10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
11. Characterization and Failure Analysis of Material, Devices and Packages
12. Future Directions and Reliability Issues
2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
3. Defects, Contamination and Yield
4. The Mathematics of Failure and Reliability
5. Mass Transport-Induced Failure
6. Electronic Charge-Induced Damage
7. Environmental Damage to Electronic Products
8. Packaging Materials, Processes, and Stresses
9. Degradation of Contacts and Packages
10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
11. Characterization and Failure Analysis of Material, Devices and Packages
12. Future Directions and Reliability Issues