Transactions on High-Performance Embedded Architectures and Compilers I
Published on 26. August 2008
Book
Paperback/Softback
376 pages
978-3-540-83675-9 (ISBN)
More details
Language
English
Place of publication
United States
Product notice
Paperback (trade)
Unsewn / adhesive bound
Dimensions
Height: 156 mm
Width: 234 mm
Thickness: 20 mm
Weight
526 gr
ISBN-13
978-3-540-83675-9 (9783540836759)
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Schweitzer Classification