Microservices
Decomposing Monolithic Mainframe Applications
Published on 6. November 2023
Book
Hardback
200 pages
978-981-5194-20-3 (ISBN)
More details
Series
Language
English
Product notice
sewn/stitched
Cloth over boards
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 13 mm
Weight
440 gr
ISBN-13
978-981-5194-20-3 (9789815194203)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification