Nanopackaging
Nanotechnologies and Electronics Packaging
Published on 23. October 2008
Book
Hardback
XXI, 543 pages
978-0-387-47325-3 (ISBN)
Description
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. "Nanopackaging" is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Reviews / Votes
From the reviews: "This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. . I am pleased to be able to conclude this . Nanopackaging: Nanotechnologies and Electronics Packaging as 'highly recommended'." (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)More details
Edition
2009
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
XXI, 543 p.
Dimensions
Height: 23.5 cm
Width: 15.5 cm
Weight
1016 gr
ISBN-13
978-0-387-47325-3 (9780387473253)
DOI
10.1007/978-0-387-47325-3
Schweitzer Classification
Other editions
New editions
Book
10/2018
2nd Edition
Springer
€213.99
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Additional editions
Book
11/2010
Springer
€169.98
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E-Book
12/2008
1st Edition
Springer
€213.99
Available for download
Person
Content
Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Application of Molecular Dynamics Simulation in Electronic Packaging.- Advances in Delamination Modeling.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges.- Nanostructured Resistor Materials.- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging.- Nanoconductive Adhesives.- Nanoparticles in Microvias.- Materials and Technology for Conductive Microstructures.- A Study of Nanoparticles in SnAg-Based Lead-Free Solders.- Nano-Underfills for Fine-Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- Carbon Nanotubes for Thermal Management of Microsystems.- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes.- Nanowires in Electronics Packaging.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanoelectronics Landscape: Application, Technology, and Economy.- Errata.