Electronics Packaging Forum
Volume Two
Published on 9. October 2011
Book
Paperback/Softback
VIII, 460 pages
978-94-010-6681-5 (ISBN)
Description
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
More details
Edition
Softcover reprint of the original 1st ed. 1991
Language
English
Place of publication
Dordrecht
Netherlands
Target group
Professional and scholarly
Research
Illustrations
VIII, 460 p.
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 26 mm
Weight
678 gr
ISBN-13
978-94-010-6681-5 (9789401066815)
DOI
10.1007/978-94-009-0439-2
Schweitzer Classification
Other editions
Additional editions
Book
01/1991
Kluwer Academic Publishers
€96.00
Article not available for order
Person
Content
1. An Introduction to Tape Automated Bonding Technology.- (Hewlett-Packard, San Jose CA).- 2. Stress Analysis for Component-Populated Circuit Cards.- (State University of New York, Binghamton NY).- 3. Modeling Concepts for the Vibration Analysis of Circuit Cards.- (State University of New York, Binghamton NY).- 4. Power Technology Packaging for the 90s.- (IBM Corporation, Endicott NY).- 5. Recent Developments in Thermal Technology for Electronics Packaging.- (IBM Corporation, Poughkeepsie NY).- 6. Heat Sinks in Forced Convection Cooling.- (State University of New York, Binghamton NY).- 7. Diamond Thin Films: Applications in Electronics Packaging.- (Air Products & Chemicals Inc, Allentown PA).- 8. Low Dielectric Materials for Packaging High Speed Electronics.- (DuPont Electronics, Wilmington DE).- 9. Integrated Optical Devices Based on Silica Waveguide Technology.- (Photonic Integration Research Inc, Columbus OH).- 10. Electrostatic and Electrical Overstress Damage in Silicon MOSFET Devices and GaAs MESFET Structures.- (Loughborough University of Technology, U.K.).- 11. Cleaning Surface Mount Assemblies: the Challenge of Finding a Substitute for CFC-113.- (Allied Signal Inc, Melrose IL).- 12. Electrical Bonding of Connectors on Jet Engine Electronics.- (General Electric Company, Johnson City NY).- 13. Parameterization of Fine Pitch Processing.- (Universal Instruments, Kirkwood NY).- 14. Electronics Packaging/Interconnect: An Industry in Transition.- (Allied Signal Inc, Morristown NJ).