Characterization of Integrated Circuit Packaging Materials
Published on 7. October 1993
Book
Hardback
292 pages
978-0-7506-9267-0 (ISBN)
Description
Addresses methods for measuring the properties of IC packages. Chapters include examples of the different analytical techniques used to measure the IC characteristics, and how to identify problems in IC packaging.
More details
Series
Language
English
Place of publication
Oxford
United Kingdom
Publishing group
Elsevier Science & Technology
Target group
College/higher education
Professional and scholarly
Illustrations
Illustrations
Dimensions
Height: 152 mm
Width: 229 mm
Weight
599 gr
ISBN-13
978-0-7506-9267-0 (9780750692670)
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Schweitzer Classification
Other editions
Additional editions
E-Book
10/2013
Elsevier
€54.95
Available for download
Content
IC packaging reliability; mold compound adhesion and strength; mechanical stress in IC packages; moisture sensitivity of plastic packages; thermal management in IC packages; electrical performance of IC packages; solderability; hermeticity; advanced interconnect technology.