Metallized Plastics 1
Fundamental and Applied Aspects
Published on 31. March 1990
Book
Hardback
IX, 284 pages
978-0-306-43389-4 (ISBN)
Description
This volume chronicles the proceedings of the Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectrics and Insulation Division of the Electrochemical Society in Chicago, October 10-12, 1988. This was the premier symposium on this topic and if the comments from the attendees are any barometer of the success of a symposium then it was a grand success. Concomitantly, it has been decided to hold it on a regular basis (at intervals of 18 months) and the second event in this series is planned as a part of the Electrochemical Society meeting in Montreal, Canada, May 6-10, 1990. Metallized plastics find a legion of applications ranging from mundane to very sophisticated. A complete catalog of the various technological applications of metallized plastics will be prohibitively long, so here some eclectic examples should suffice to show why there is such high tempo of R&D activity in the arena of metallized plastics, and all signals indicate that this high tempo will continue unabated. For example, polymeric films are metallized for packaging (food and other products) purposes, and the applications of metallized plastics in the automotive industry are quite obvious. In the field of microelectronics and computer technology, insulators are metallized for interconnection and other functional purposes. Also plastics are metallized to provide electromagnetic shielding.
More details
Edition
1989 ed.
Language
English
Place of publication
New York
United States
Publishing group
Springer Science+Business Media
Target group
Professional and scholarly
Research
Illustrations
IX, 284 p.
Dimensions
Height: 234 mm
Width: 156 mm
Thickness: 17 mm
Weight
459 gr
ISBN-13
978-0-306-43389-4 (9780306433894)
DOI
10.1007/978-1-4899-0879-7
Schweitzer Classification
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11/2013
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06/2013
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Content
Metallization Techniques and Properties of Metal Deposits.- Laser Stimulated Chemical Vapor Deposition of Metals on Polyimides.- Graded Metallization of Nonconducting Substrates by Glow Discharge Plasma Polymerization.- Metallization of Plastics with Resistance Heated Sources.- High Rate Reactive Sputtering onto Flexible Polymer Sheet.- UV Laser-Induced Metallization of Polyimide from Electroplating Solution.- Simple Metal-on-Plastics Patterning by Pulsed Electron Beam in Soft Vacuum.- Optical Performance and Durability of Silvered Polymer Mirrors.- Deposition of Adherent, Thick Copper Coatings on Glass.- Dependence of Stress on Deposition Conditions for Sputtered Copper Films onto Flexible Polyimide Substrates.- Metal Interlayers in Polymer Films: A Survey of Deposition Processes, Morphology, Patterning Methods and Physical Properties.- Spectroscopic Investigation of Interfacial Interactions.- Surface Spectroscopic Techniques Applied to Metallized Plastics.- A Static SIMS Study of Interfaces between Evaporated Metal Films and Polyimides.- XPS and HREELS Study of the Aluminum/Poly(ethylene terephthalate) Interface and the Influence of the Polymer Surface Pretreatment on Adhesion.- Interfacial Chemistry of Metal Films on Polymers: Diffusion, Oxidation, Trace Components Studied by XPS, ISS, and SIMS.- Surface Modification and Adhesion Aspects.- Characterization of Surface Modifications during Metallization of Polyetherimide.- Effect of Plasma Treatment and Ion-Plating on Adhesion of Metallized Polyimide and Poly(ethylene terephthalate).- Adhesion of Chromium, Nickel, and Copper to Polymers Containing Basic Functional Groups.- Adhesion and Deformation Behavior of Thin Metal Films on Polyimide.