Adhesion in Microelectronics

Preface xiii Acknowledgements xvi Part 1: Adhesion: Fundamentals and Measurement 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics 3 Robert R. Mallik 1.1 Introduction 3 1.2 Principles of IETS 6 1.3 Application of IETS in Microelectronics 13 1.4 Prospects 24 1.5 Summary 26 References 27 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics 33 Wei-Sheng Lei and Ajay Kumar 2.1 Introduction 33 2.2 Mechanical Methods 36 2.3 Laser Based Techniques 51 2.4 Summary and Remarks 56 References 59 Part 2: Ways to Promote/Enhance Adhesion 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion 67 Jörg Friedrich 3.1 Introduction 67 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules 87 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate 92 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces 94 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces 103 3.6 Reactions and Bond Formation at the Interface 110 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces 112 3.8 Summary and Conclusions 121 Acknowledgement 123 References 123 4 Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging 137 Hang Yu, Yiyuan Zhang, Anita Wong, Igor M. De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and Robert F. Hicks 4.1 Introduction 137 4.2 Plasma Fundamentals 139 4.3 Survey of Vacuum Plasma Treatment of Polymers 146 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers 151 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics 153 4.6 Vacuum Versus Atmospheric Plasmas for Use in Semiconductor Packaging 165 References 166 5 Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications 173 James E. Morris and Liang Wang 5.1 Introduction 173 5.2 ICA Technology 174 5.3 Technology Reviews 176 5.4 Electrical Properties 176 5.5 Mechanical Properties 180 5.6 Thermal Properties 181 5.7 Metallic Filler 181 5.8 Polymer Materials 184 5.9 Reliability 186 5.10 Dispensation 188 5.11 Environmental Properties 189 5.12 Other Results 189 5.13 Summary 190 5.14 Prospects 190 References 191 Part 3: Reliability and Failure Mechanisms 6 Role of Adhesion Phenomenon in the Reliability of Electronic Packaging 213 Puligandla Viswanadham 6.1 Introduction 214 6.2 Hierarchy of Electronic Packaging. 216 6.3 Substrates, Carriers, and Laminates 217 6.4 Flexible Laminates 236 6.5 First Level Packaging /Semiconductor Packaging 237 6.6 Second Level Packaging 247 6.7 Reliability Enhancements 256 6.8 Thermal Management 260 6.9 Summary 261 Acknowledgements 262 References 252 Suggested Reading 262 References 262 7 Delamination and Reliability Issues in Packaged Devices 267 Wei-Sheng Lei and Ajay Kumar 7.1 Introduction 267 7.2 Basic Aspects of Delamination Failure 269 7.3 Evaluation of Delamination Initiation in Electronic Packages 280 7.4 Evaluation of Delamination Propagation in Electronic Packages 290 7.5 Summary 304 References 305 8 Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages 313 Tanweer Ahsan and Andrew Schoenberg 8.1 Introduction 313 8.2 Thermal Methods of Characterizatio 314 8.3 Stresses in Encapsulated Devices 320 8.4 More on Adhesion of Molding Compounds - Surface Chemical and Morphological Aspects 332 8.5 Summary 337 References 338