The World of Electronic Packaging and System Integration

This edition is a co-production of the editors, a large number of the staff of the various departments of the Fraunhofer Institute IZM Berlin and the Berlin Center of Electronic Packaging (BeCAP) at the Technical University Berlin, as well as renowned contributors from elsewhere in Germany and other countries in Europe and the world. The wide thematic scope of this edition wonderfully illustrates the wide scientific scope of Professor Herbert Reichl's interests and activities, best reflected in the fields of electronic packaging and system integration. Many of the articles and papers have been co-authored by Herbert Reichl himself, and the contributions he made were not just from the sidelines.