
High Temperature Electronics
CRC Press
1st Edition
Published on 13. December 1996
Book
Hardback
350 pages
978-0-8493-9623-6 (ISBN)
Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 degreesC and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.
Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 degreesC. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.
High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.
Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 degreesC. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.
High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.
Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
More details
Language
English
Place of publication
Bosa Roca
United States
Publishing group
Taylor & Francis Inc
Target group
College/higher education
Professional and scholarly
Academic and Professional Practice & Development
Illustrations
27 figs., 39 tabs.
Dimensions
Height: 260 mm
Width: 183 mm
Thickness: 23 mm
Weight
836 gr
ISBN-13
978-0-8493-9623-6 (9780849396236)
Schweitzer Classification
Other editions
Additional editions

F. Patrick McCluskey | Thomas Podlesak | Richard Grzybowski
High Temperature Electronics
Book
10/2019
1st Edition
CRC Press
€98.60
Shipment within 15-20 days

F. Patrick McCluskey | Thomas Podlesak | Richard Grzybowski
High Temperature Electronics
E-Book
05/2018
1st Edition
CRC Press
€92.49
Available for download

F. Patrick McCluskey | Thomas Podlesak | Richard Grzybowski
High Temperature Electronics
E-Book
05/2018
1st Edition
CRC Press
€92.49
Available for download
Persons
McCluskey, F. Patrick; Podlesak, Thomas; Grzybowski, Richard
Content
Chapter 1. Overview of High Temperature Electronics Chapter 2. Selection and Use of Silicon Devices at High Temperatures. Chapter 3. Wide Bandgap Semiconductors. Chapter 4. Passive Device Selection and Use at High Temperature. Chapter 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 7. Thermal Management Considerations for Elevated Temperature Chapter 8. Applications. Chapter 9. Accelerated Testing of Elevated Temperature Electronics. References. Index