
Semiconductor Device Modeling with Spice
McGraw-Hill Professional (Publisher)
3rd Edition
Published on 16. December 1998
Book
Paperback/Softback
479 pages
978-0-07-134955-0 (ISBN)
Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
More details
Edition
3rd ed.
Language
English
Place of publication
United States
Publishing group
McGraw-Hill Education - Europe
Target group
College/higher education
Dimensions
Height: 234 mm
Width: 156 mm
Thickness: 27 mm
Weight
746 gr
ISBN-13
978-0-07-134955-0 (9780071349550)
Schweitzer Classification
Persons
Giuseppe Massobrio is a research associate in the department of electronic engineering (DIBE) at the University of Genova. He has done research in the areas of semiconductor device modeling as well as circuit simulation and optimization. He is the author of several papers on semiconductor device models for CAD applications. He is currently researching the development of semiconductor-based biosensor models for biomedical technologies.
Paolo Antognetti is a professor and chairman of the department of electronic engineering (DIBE) at the University of Genova. His extensive background in semiconductor modeling includes teaching and research positions at Stanford University and MIT. He has contributed to more than fifty papers in the field of electronics and VSLI design and simulation. He has edited several books, including Power Integrated Circuits: Physics, Design, and Applications, also published by McGraw-Hill.
Paolo Antognetti is a professor and chairman of the department of electronic engineering (DIBE) at the University of Genova. His extensive background in semiconductor modeling includes teaching and research positions at Stanford University and MIT. He has contributed to more than fifty papers in the field of electronics and VSLI design and simulation. He has edited several books, including Power Integrated Circuits: Physics, Design, and Applications, also published by McGraw-Hill.