
Handbook of Lapping and Polishing
CRC Press
1st Edition
Published on 20. November 2006
Book
Hardback
508 pages
978-1-57444-670-8 (ISBN)
Description
Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.
Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.
Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.
Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.
Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.
More details
Series
Language
English
Place of publication
Bosa Roca
United States
Publishing group
Taylor & Francis Inc
Target group
Professional and scholarly
Professional
Illustrations
378 s/w Abbildungen, 74 s/w Photographien bzw. Rasterbilder, 38 s/w Tabellen
38 Tables, black and white; 74 Halftones, black and white; 378 Illustrations, black and white
Dimensions
Height: 234 mm
Width: 156 mm
Weight
793 gr
ISBN-13
978-1-57444-670-8 (9781574446708)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

Ioan D. Marinescu | Eckart Uhlmann | Toshiro Doi
Handbook of Lapping and Polishing
E-Book
11/2006
CRC Press
€311.99
Available for download

Ioan D. Marinescu | Eckart Uhlmann | Toshiro Doi
Handbook of Lapping and Polishing
E-Book
11/2006
1st Edition
CRC Press
€311.99
Available for download
Persons
Marinescu, Ioan D.; Uhlmann, Eckart; Doi, Toshiro
Editor
University of Toledo, Ohio, USA
Saitama University, Japan
Content
Introduction. Fundamentals of Lapping. Lapping of Ductile Materials. Lapping of Brittle Materials. Lapping and Lapping Machines. Polishing Technology. Chemical Mechanical Polishing and Its Applications. Index.