Capacitively Coupled Chip-To-Chip Interconnect Design
Published on 6. May 2010
Book
Paperback/Softback
140 pages
978-3-639-25336-8 (ISBN)
More details
Language
English
Place of publication
Germany
Product notice
Paperback (trade)
Unsewn / adhesive bound
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 8 mm
Weight
216 gr
ISBN-13
978-3-639-25336-8 (9783639253368)
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Schweitzer Classification