Foundations of MEMS
Published on 3. October 2005
Book
Hardback
576 pages
978-0-13-147286-0 (ISBN)
Description
For courses in Micro-Electro-Mechanical Systems (MEMS) taken by advanced undergraduate students, beginning graduate students, and professionals.
Foundations of MEMS is the first entry-level text of its kind for systematically teaching the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology - all in a time-efficient and methodical manner. A wealth of examples and problems solidify students' understanding of abstract concepts and provide ample opportunities for practicing critical thinking.
Foundations of MEMS is the first entry-level text of its kind for systematically teaching the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology - all in a time-efficient and methodical manner. A wealth of examples and problems solidify students' understanding of abstract concepts and provide ample opportunities for practicing critical thinking.
More details
Language
English
Place of publication
United States
Publishing group
Pearson Education (US)
Target group
College/higher education
Dimensions
Height: 198 mm
Width: 241 mm
Thickness: 30 mm
Weight
1066 gr
ISBN-13
978-0-13-147286-0 (9780131472860)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
New editions
Chang Liu
Foundation of MEMS
Book
06/2024
2nd Edition
Pearson International
€109.99
Shipment within 10-20 days
Content
(NOTE: All chapters start with a Preview and conclude with Problems and References.)
Chapter 1: Introduction
1.0. Preview
1.1. The History of MEMS Development
1.2. The Intrinsic Characteristics of MEMS
1.3. Devices: Sensors and Actuators
Chapter 2: Introduction to Microfabrication
2.0. Preview
2.1. Overview of Microfabrication
2.2. The Microelectronics Fabrication Process
2.3. Silicon-based MEMS Process
2.4. New Materials and Fabrication Processes
2.5. Points of Consideration for Processing
Chapter 3: Review of Essential Electrical and Mechanical Concepts
3.0. Preview
3.1. Conductivity of Semiconductors
3.2. Crystal Planes and Orientations
3.3. Stress and Strain
3.4. Flexural Beam Bending Analysis Under Simple Loading Conditions
3.5. Torsional Deflections
3.6. Intrinsic Stress
3.7. Resonant Frequency and Quality Factor
3.8. Active Tuning of Spring Constant and Resonant Frequency
3.9. A List of Suggested Courses and Books
Chapter 4: Electrostatic Sensing and Actuation
4.0. Preview
4.1. Introduction to Electrostatic Sensors and Actuators
4.2. Parallel-Plate Capacitors
4.3. Applications of Parallel-Plate Capacitors
4.4. Interdigitated Finger Capacitors
4.5. Applications of Comb-Drive Devices
Chapter 5: Thermal Sensing and Actuation
5.0. Preview
5.1. Introduction
5.2. Sensors and Actuators Based on Thermal Expansion
5.3. Thermal Couples
5.4. Thermal Resistors
5.5. Applications
Chapter 6: Piezoresistive Sensors
6.0. Preview
6.1. Origin and Expression of Piezoresistivity
6.2. Piezoresistive Sensor Materials
6.3. Stress Analysis of Mechanical Elements
6.4. Applications of Piezoresistive Sensors
Chapter 7: Piezoelectric Sensing and Actuation
7.0. Preview
7.1. Introduction
7.2. Properties of Piezoelectric Materials
7.3. Applications
Chapter 8: Magnetic Actuation
8.0. Preview
8.1. Essential Concepts and Principles
8.2 Fabrication of Micromagnetic Components
8.3. Case Studies of MEMS Magnetic Actuators
Chapter 9: Summary of Sensing and Actuation
9.0. Preview
9.1. Comparison of Major Sensing and Actuation Methods
9.2. Tunneling Sensing
9.3. Optical Sensing
9.4. Field Effect Transistors
9.5. Radio Frequency Resonance Sensing
Chapter 10: Bulk Micromachining and Silicon Anisotropic Etching
10.0. Preview
10.1. Introduction
10.2. Anisotropic Wet Etching
10.3. Dry Etching of Silicon - Plasma Etching
10.4. Deep Reactive Ion Etching (DRIE)
10.5. Isotropic Wet Etching
10.6. Gas-Phase Etchants
10.7. Native Oxide
10.8. Wafer bonding
10.9. Case Studies
Chapter 11: Surface Micromachining
11.0. Preview
11.1. Basic Surface Micromachining Processes
11.2. Structural and Sacrificial Materials
11.3. Acceleration of Sacrificial Etch
11.4. Stiction and AntiStiction Methods
11.5. Assembly of 3D MEMS
11.6. Foundry Process
Chapter 12: Polymer MEMS
12.0. Preview
12.1. Introduction
12.2. Polymers in MEMS
12.3. Representative Applications
Chapter 13: Microfluidics Applications
13.0. Preview
13.1. Motivation for Microfluidics
13.2. Essential Biology Concepts
13.3. Basic Fluid Mechanics Concepts
13.4. Design and Fabrication of Selective Components
Chapter 14: Instruments for Scanning Probe Microscopy
14.0. Preview
14.1. Introduction
14.2. General Fabrication Methods for Tips
14.3. Cantilevers with Integrated Tips
14.4. SPM probes with Sensors and Actuators
Chapter 15: Optical MEMS
15.0. Preview
15.1. Passive MEMS Optical Components
15.2. Actuators for Active Optical MEMS
Chapter 16. MEMS Technology Management
16.0. Preview
16.1. R&D Strategies
Chapter 1: Introduction
1.0. Preview
1.1. The History of MEMS Development
1.2. The Intrinsic Characteristics of MEMS
1.3. Devices: Sensors and Actuators
Chapter 2: Introduction to Microfabrication
2.0. Preview
2.1. Overview of Microfabrication
2.2. The Microelectronics Fabrication Process
2.3. Silicon-based MEMS Process
2.4. New Materials and Fabrication Processes
2.5. Points of Consideration for Processing
Chapter 3: Review of Essential Electrical and Mechanical Concepts
3.0. Preview
3.1. Conductivity of Semiconductors
3.2. Crystal Planes and Orientations
3.3. Stress and Strain
3.4. Flexural Beam Bending Analysis Under Simple Loading Conditions
3.5. Torsional Deflections
3.6. Intrinsic Stress
3.7. Resonant Frequency and Quality Factor
3.8. Active Tuning of Spring Constant and Resonant Frequency
3.9. A List of Suggested Courses and Books
Chapter 4: Electrostatic Sensing and Actuation
4.0. Preview
4.1. Introduction to Electrostatic Sensors and Actuators
4.2. Parallel-Plate Capacitors
4.3. Applications of Parallel-Plate Capacitors
4.4. Interdigitated Finger Capacitors
4.5. Applications of Comb-Drive Devices
Chapter 5: Thermal Sensing and Actuation
5.0. Preview
5.1. Introduction
5.2. Sensors and Actuators Based on Thermal Expansion
5.3. Thermal Couples
5.4. Thermal Resistors
5.5. Applications
Chapter 6: Piezoresistive Sensors
6.0. Preview
6.1. Origin and Expression of Piezoresistivity
6.2. Piezoresistive Sensor Materials
6.3. Stress Analysis of Mechanical Elements
6.4. Applications of Piezoresistive Sensors
Chapter 7: Piezoelectric Sensing and Actuation
7.0. Preview
7.1. Introduction
7.2. Properties of Piezoelectric Materials
7.3. Applications
Chapter 8: Magnetic Actuation
8.0. Preview
8.1. Essential Concepts and Principles
8.2 Fabrication of Micromagnetic Components
8.3. Case Studies of MEMS Magnetic Actuators
Chapter 9: Summary of Sensing and Actuation
9.0. Preview
9.1. Comparison of Major Sensing and Actuation Methods
9.2. Tunneling Sensing
9.3. Optical Sensing
9.4. Field Effect Transistors
9.5. Radio Frequency Resonance Sensing
Chapter 10: Bulk Micromachining and Silicon Anisotropic Etching
10.0. Preview
10.1. Introduction
10.2. Anisotropic Wet Etching
10.3. Dry Etching of Silicon - Plasma Etching
10.4. Deep Reactive Ion Etching (DRIE)
10.5. Isotropic Wet Etching
10.6. Gas-Phase Etchants
10.7. Native Oxide
10.8. Wafer bonding
10.9. Case Studies
Chapter 11: Surface Micromachining
11.0. Preview
11.1. Basic Surface Micromachining Processes
11.2. Structural and Sacrificial Materials
11.3. Acceleration of Sacrificial Etch
11.4. Stiction and AntiStiction Methods
11.5. Assembly of 3D MEMS
11.6. Foundry Process
Chapter 12: Polymer MEMS
12.0. Preview
12.1. Introduction
12.2. Polymers in MEMS
12.3. Representative Applications
Chapter 13: Microfluidics Applications
13.0. Preview
13.1. Motivation for Microfluidics
13.2. Essential Biology Concepts
13.3. Basic Fluid Mechanics Concepts
13.4. Design and Fabrication of Selective Components
Chapter 14: Instruments for Scanning Probe Microscopy
14.0. Preview
14.1. Introduction
14.2. General Fabrication Methods for Tips
14.3. Cantilevers with Integrated Tips
14.4. SPM probes with Sensors and Actuators
Chapter 15: Optical MEMS
15.0. Preview
15.1. Passive MEMS Optical Components
15.2. Actuators for Active Optical MEMS
Chapter 16. MEMS Technology Management
16.0. Preview
16.1. R&D Strategies