1991 Proceedings International Conference on Wafer Scale Integration
January 29-31, 1991 San Francisco, California, USA
Published on 15. June 2006
Book
Hardback
342 pages
978-0-8186-9126-3 (ISBN)
More details
Language
English
Place of publication
Los Alamitos, CA
United States
Target group
College/higher education
Professional and scholarly
Dimensions
Height: 230 mm
ISBN-13
978-0-8186-9126-3 (9780818691263)
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Schweitzer Classification