
Solder Materials
Kwang-lung Lin(Author)
World Scientific Publishing Co Pte Ltd
Published on 5. September 2018
Book
Hardback
388 pages
978-981-323-760-5 (ISBN)
Description
This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
More details
Series
Language
English
Place of publication
Singapore
Singapore
Target group
College/higher education
Professional and scholarly
Dimensions
Height: 235 mm
Width: 157 mm
Thickness: 25 mm
Weight
711 gr
ISBN-13
978-981-323-760-5 (9789813237605)
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Schweitzer Classification