Polymers for Microelectronics and Nanoelectronics
Published on 29. April 2004
Book
Hardback
352 pages
978-0-8412-3857-2 (ISBN)
Description
Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and
applications of these materials.
applications of these materials.
Reviews / Votes
Each chapter is well-illustrated and well-referenced and can certainly serve to orient the scientist or engineer to these new developments. This is a book that practising micro-engineers will want to have as a reference. Materials World, November 2006More details
Series
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Illustrations
170 line illus. & 38 halftones
Dimensions
Height: 236 mm
Width: 160 mm
Thickness: 22 mm
Weight
546 gr
ISBN-13
978-0-8412-3857-2 (9780841238572)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Editor
Research Staff MemberResearch Staff Member, IBM T. J. Watson Research Center
Associate Professor of Materials Science and EngineeringAssociate Professor of Materials Science and Engineering, Lehigh University
Manager, Technical Research StrategyManager, Technical Research Strategy, IBM T. J. Watson Research Center
Content
Preface
1: Zhenan Bao: Recent Progress in Materials for Organic Electronics
2: Kyungkon Kim, Guolun Zhong, Jung-Il Jin, Jung Ho Park, Seoung Hyun Lee, Dong Woo Kim, Yung Woo Park, and Whikun Yi: PPV Nanotubes, Nanorods, and Nanofilms as well as Carbonized Objects Derived Therefrom
3: M.E. van der Boom and T.J. Marks: Layer-by-Layer Assembly of Molecular Materials for Electrooptical Applications
4: Sung-Yeon Jang, Manuel Marquez, and Gregory A. Sotzing: Oxidative Solid-State Cross-Linking of Polymer Precursors to Pattern Intrinsically Conducting Polymers
5: T.H. Fedynyshyn, W.A. Mowers, R.R. Kunz, R.F. Sinta, M. Sworin, A. Cabral, and J. Curtin: Fluorocarbon Polymer-Based Photoresists for 157-nm Lithography
6: Toshiro Itani, Hiroyuki Watanabe, Tamio Yamazaki, Seichi Ishikawa, Naomi Shida, and Minoru Toriumi: 157-nm Resist Materials Using Main-Chain Fluorinated Polymers
7: Ronald L. Jones, Vivek M. Prabhu, Dario L. Goldfarb, Eric K. Lin, Christopher L. Soles, Joseph L. Lenhart, Wen-li Wu, and Marie Angelopoulos: Correlation of the Reaction Front with Roughness in Chemically Amplified Photoresists
8: Joseph L. Lenhart, Daniel A. Fischer, Sharadha Sambasivan, Eric K. Lin, Christopher L. Soles, Ronald L. Jones, Wen-li Wu, Dario L. Goldfarb, and Marie Angelopoulos: Utilizing Near Edge X-ray Absorption Fine Structure to Probe Interfacial Issues in Photolithography
9: B. Voit, F. Braun, Ch. Loppacher, S. Trogisch, L.M. Eng, R. Seidel, A. Gorbunoff, W. Pompe, and M. Mertig: Photolabile Ultrathin Polymer Films for Spatially Defined Attachment of Nano Elements
10: Martin Brehmer, Lars Conrad, Lutz Funk, Dirk Allard, Patrick Theato, and Anke Helfer: Soft Lithography on Block Copolymer Films: Generating Functionalized Patterns on Block Copolymer Films as a Basis to Further Surface Modification
11: R.D. Miller, W. Volksen, V.Y. Lee, E. Conner, T. Magbitang, R. Zafran, L. Sundberg, C.J. Hawker, J.L. Hedrick, E. Huang, M. Tooney, Q.R. Huang, C.W. Frank, and H.-C. Kim: Nanoporous, Low-Dielectric Constant Organosilicate Materials Derived from Inorganic Polymer Blends
12: C. Tyberg, E. Huang, J. Hedrick, E. Simonyi, S. Gates, S. Cohen, K. Malone, H. Wickland, M. Sankarapandian, M. Toney, H.-C. Kim, R. Miller, W. Volksen, P. Rice, and L. Lurio: Porous Low-k Dielectrics: Material Properties
13: Bianxiao Zhong and Eric S. Moyer: Ultra Low-k Dielectic Films with Ultra Small Pores Using Poragens Chemically Bonded to Silozane Resin
14: H. Craig Silvis, Kevin J. Bouck, James P. Godschalx, Q. Jason Niu, Michael J. Radler, Ted M. Stokich, John W. Lyons, Brandon J. Kern, Joan G. Marshall, Karin Syverud, and Mary Leff: Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices
15: Q. Jason Niu, Steven J. Martin, James P. Godschalx, and Paul H. Townsend: Molecular Brushes as Templating Agents for Nanoporous SiLK* Dielectric Films
16: Christopher L. Soles, Hae-Jeong Lee, Ronald C. Hedden, Da-wei Liu, Barry J. Bauer, and Wen-li Wu: X-ray Reflectivity as a Metrology to Characterize Pores in Low-k Dielectric Films
17: Sara N. Paisner and Joseph M. DeSimone: Micro- and Nanoporous Materials Developed Using Supercritical CO2: Novel Synthetic Methods for the Development of Micro- and Nanoporous Materials Toward Microelectronic Applications
18: Masamitsu Shirai, Satoshi Morishita, Akiya Kawaue, Haruyuki Okamura, and Masahiro Tsunooka: Thermally Degradable Photocross-Linking Polymers
19: Robert K. Oldak and Raymond A. Pearson: Evaluation of Infrared Spectroscopic Techniques to Assess Molecular Interactions
20: Zhuqing Zhang and C.P. Wong: Study on Metal Chelates as Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow Underfill Applications
21: Ying-Hung So, Phil E. Garrou, Jang-Hi Im, and Karou Ohba: Benzocyclobutene-Based Polymers for Microelectronic Applications
22: A.L.Cholli, S.K. Sahoo, D.W. Kim, J. Kumar, and A. Blumstein: Formation of Nanocomposites by In Situ Intercalative Polymerization of 2-Ethynylpyrdine in Layered Aluminosilicates: A Solid-State NMR Study
Author Index
Subject Index
1: Zhenan Bao: Recent Progress in Materials for Organic Electronics
2: Kyungkon Kim, Guolun Zhong, Jung-Il Jin, Jung Ho Park, Seoung Hyun Lee, Dong Woo Kim, Yung Woo Park, and Whikun Yi: PPV Nanotubes, Nanorods, and Nanofilms as well as Carbonized Objects Derived Therefrom
3: M.E. van der Boom and T.J. Marks: Layer-by-Layer Assembly of Molecular Materials for Electrooptical Applications
4: Sung-Yeon Jang, Manuel Marquez, and Gregory A. Sotzing: Oxidative Solid-State Cross-Linking of Polymer Precursors to Pattern Intrinsically Conducting Polymers
5: T.H. Fedynyshyn, W.A. Mowers, R.R. Kunz, R.F. Sinta, M. Sworin, A. Cabral, and J. Curtin: Fluorocarbon Polymer-Based Photoresists for 157-nm Lithography
6: Toshiro Itani, Hiroyuki Watanabe, Tamio Yamazaki, Seichi Ishikawa, Naomi Shida, and Minoru Toriumi: 157-nm Resist Materials Using Main-Chain Fluorinated Polymers
7: Ronald L. Jones, Vivek M. Prabhu, Dario L. Goldfarb, Eric K. Lin, Christopher L. Soles, Joseph L. Lenhart, Wen-li Wu, and Marie Angelopoulos: Correlation of the Reaction Front with Roughness in Chemically Amplified Photoresists
8: Joseph L. Lenhart, Daniel A. Fischer, Sharadha Sambasivan, Eric K. Lin, Christopher L. Soles, Ronald L. Jones, Wen-li Wu, Dario L. Goldfarb, and Marie Angelopoulos: Utilizing Near Edge X-ray Absorption Fine Structure to Probe Interfacial Issues in Photolithography
9: B. Voit, F. Braun, Ch. Loppacher, S. Trogisch, L.M. Eng, R. Seidel, A. Gorbunoff, W. Pompe, and M. Mertig: Photolabile Ultrathin Polymer Films for Spatially Defined Attachment of Nano Elements
10: Martin Brehmer, Lars Conrad, Lutz Funk, Dirk Allard, Patrick Theato, and Anke Helfer: Soft Lithography on Block Copolymer Films: Generating Functionalized Patterns on Block Copolymer Films as a Basis to Further Surface Modification
11: R.D. Miller, W. Volksen, V.Y. Lee, E. Conner, T. Magbitang, R. Zafran, L. Sundberg, C.J. Hawker, J.L. Hedrick, E. Huang, M. Tooney, Q.R. Huang, C.W. Frank, and H.-C. Kim: Nanoporous, Low-Dielectric Constant Organosilicate Materials Derived from Inorganic Polymer Blends
12: C. Tyberg, E. Huang, J. Hedrick, E. Simonyi, S. Gates, S. Cohen, K. Malone, H. Wickland, M. Sankarapandian, M. Toney, H.-C. Kim, R. Miller, W. Volksen, P. Rice, and L. Lurio: Porous Low-k Dielectrics: Material Properties
13: Bianxiao Zhong and Eric S. Moyer: Ultra Low-k Dielectic Films with Ultra Small Pores Using Poragens Chemically Bonded to Silozane Resin
14: H. Craig Silvis, Kevin J. Bouck, James P. Godschalx, Q. Jason Niu, Michael J. Radler, Ted M. Stokich, John W. Lyons, Brandon J. Kern, Joan G. Marshall, Karin Syverud, and Mary Leff: Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices
15: Q. Jason Niu, Steven J. Martin, James P. Godschalx, and Paul H. Townsend: Molecular Brushes as Templating Agents for Nanoporous SiLK* Dielectric Films
16: Christopher L. Soles, Hae-Jeong Lee, Ronald C. Hedden, Da-wei Liu, Barry J. Bauer, and Wen-li Wu: X-ray Reflectivity as a Metrology to Characterize Pores in Low-k Dielectric Films
17: Sara N. Paisner and Joseph M. DeSimone: Micro- and Nanoporous Materials Developed Using Supercritical CO2: Novel Synthetic Methods for the Development of Micro- and Nanoporous Materials Toward Microelectronic Applications
18: Masamitsu Shirai, Satoshi Morishita, Akiya Kawaue, Haruyuki Okamura, and Masahiro Tsunooka: Thermally Degradable Photocross-Linking Polymers
19: Robert K. Oldak and Raymond A. Pearson: Evaluation of Infrared Spectroscopic Techniques to Assess Molecular Interactions
20: Zhuqing Zhang and C.P. Wong: Study on Metal Chelates as Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow Underfill Applications
21: Ying-Hung So, Phil E. Garrou, Jang-Hi Im, and Karou Ohba: Benzocyclobutene-Based Polymers for Microelectronic Applications
22: A.L.Cholli, S.K. Sahoo, D.W. Kim, J. Kumar, and A. Blumstein: Formation of Nanocomposites by In Situ Intercalative Polymerization of 2-Ethynylpyrdine in Layered Aluminosilicates: A Solid-State NMR Study
Author Index
Subject Index