3D Microelectronic Packaging
From Fundamentals to Applications
Published on 1. February 2017
Book
Hardback
IX, 463 pages
978-3-319-44584-7 (ISBN)
Description
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
More details
Series
Edition
1st ed. 2017
Language
English
Place of publication
Cham
Switzerland
Publishing group
Springer International Publishing
Target group
Professional and scholarly
Illustrations
78 s/w Abbildungen, 253 farbige Abbildungen
253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 illus. in color.
Dimensions
Height: 23.5 cm
Width: 15.5 cm
Weight
8336 gr
ISBN-13
978-3-319-44584-7 (9783319445847)
DOI
10.1007/978-3-319-44586-1
Schweitzer Classification
Other editions
New editions
Book
11/2020
2nd Edition
Springer
€192.59
Shipment within 3-4 weeks
Additional editions
Book
07/2018
Springer
€192.59
Shipment within 10-15 days
E-Book
01/2017
Springer
€181.89
Available for download
Content
Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV.- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging.- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages .- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging.- Fundamentals of advanced materials and processes in organic substrate technology.- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization.- Processing and Reliability of Solder Interconnections in Stacked Packaging.- Interconnect Quality and Reliability of 3D Packaging.- Fault isolation and failure analysis of 3D packaging.