
Arm Assembly for Embedded Applications, 3rd Edition
Daniel W. Lewis(Author)
BOOKBABY (Publisher)
Published on 7. September 2017
Book
Paperback/Softback
318 pages
978-1-5439-0804-6 (ISBN)
More details
Language
English
Product notice
Paperback (trade)
Unsewn / adhesive bound
Illustrations
Illustrations
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 23 mm
Weight
544 gr
ISBN-13
978-1-5439-0804-6 (9781543908046)
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Schweitzer Classification