Three-Dimensional Integration and Modeling
A Revolution in RF and Wireless Packaging
Published on 28. February 2007
Book
Paperback/Softback
108 pages
978-1-59829-244-2 (ISBN)
Description
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
More details
Series
Language
English
Place of publication
San Rafael
United States
Target group
Professional and scholarly
Dimensions
Height: 235 mm
Width: 187 mm
ISBN-13
978-1-59829-244-2 (9781598292442)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Content
- Introduction
- Background on Technologies for Millimeter-Wave Passive Front-Ends
- Three-Dimensional Packaging in Multilayer Organic Substrates
- Microstrip-Type Integrated Passives
- Cavity-Type Integrated Passives
- Three-Dimensional Antenna Architectures
- Fully Integrated Three-Dimensional Passive Front-Ends
- References
- Background on Technologies for Millimeter-Wave Passive Front-Ends
- Three-Dimensional Packaging in Multilayer Organic Substrates
- Microstrip-Type Integrated Passives
- Cavity-Type Integrated Passives
- Three-Dimensional Antenna Architectures
- Fully Integrated Three-Dimensional Passive Front-Ends
- References