Modern Receiver Front-Ends
Systems, Circuits, and Integration
Will be published approx. on 5. March 2004
Book
Hardback
240 pages
978-0-471-22591-1 (ISBN)
Description
Architectures BABAK MATINPOUR and JOY LASKAR
* Describes the actual implementation of receiver architectures from the initial design to an IC-based product
* Presents many tricks-of-the-trade not usually covered in textbooks
* Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis
* Discusses architectures that are employed in modern broadband wireless systems
Reviews / Votes
"Such a book will be helpful for the understanding of receiver front-end development and architectural trade-offs." (Microwave Journal, September 2004) "The well-written text is illustrated with numerous references. " (Choice, June 2004, Vol. 41 No. 10)More details
Product info
gebunden
Edition
1. Auflage
Language
English
Place of publication
United States
Publishing group
John Wiley & Sons Inc
Target group
Professional and scholarly
Product notice
sewn/stitched
Cloth over boards
Dimensions
Height: 240 mm
Width: 161 mm
Thickness: 17 mm
Weight
525 gr
ISBN-13
978-0-471-22591-1 (9780471225911)
Schweitzer Classification
Other editions
Additional editions
Joy Laskar | Babak Matinpour | Sudipto Chakraborty
Modern Receiver Front-Ends
Systems, Circuits, and Integration
E-Book
04/2004
Wiley
€141.99
Available for download
Persons
JOY LASKAR, PhD, is the Joseph M. Pettit Professor of Electrical and Computer Engineering at the Georgia Institute of Technology. He is the author of over 200 technical papers and has fifteen patents pending. Professor Laskar has also received numerous awards for his work, including the Army Research Office's Young Investigator Award, the National Science Foundation's CAREER Award, and the IEEE Rappaport Award. He is Director of the Georgia Electronic Design Center (GEDC).
BABAK MATINPOUR, PhD, is the cofounder and vice president of VT Silicon Inc., a fables wireless start-up developing next generation Ics for 3G mobile phones. Dr. Matinpour has published over twenty IEEE papers and presented several invited talks on GaAs and SiGe RF ICs.
SUDIPTO CHAKRABORTY, PhD, is a senior research engineer in the School of Electrical and Computer Engineering at the Georgia Institute of Technology, Atlanta, Georgia, where he is involved in analysis, design, and characterization of advanced wired and wireless circuits and systems towards advanced communication technologies using silicon-based processes. Dr. Chakraborty has authored or coauthored over thirty technical articles, presented several invited talks in the area of integrated transceiver design, and has two patents pending.
Content
Preface.
Acknowledgments.
1 INTRODUCTION.
1.1 Current State of the Art.
2 RECEIVER SYSTEM DESIGN.
2.1 Frequency Planning.
2.2 Link Budget Analysis.
2.3 Propagation Effects.
2.4 Interface Planning.
2.5 Conclusion.
3 REVIEW OF RECEIVER ARCHITECTURES.
3.1 Heterodyne Receivers.
3.2 Image Reject Receivers.
3.3 Zero IF Receivers.
3.4 Low IF Receivers.
3.5 I ssues in Direct Conversion Receivers.
3.6 Architecture Comparison and Trade-off.
3.7 Conclusion.
4 SILICON-BASED RECEIVER DESIGN.
4.1 Receiver Architecture and Design.
4.2 Circuit Design.
4.3 Receiver Design Steps.
4.4 Layout Considerations.
4.5 Characterization of Receiver Front-Ends.
4.6 Measurement Results and Discussions.
4.7 Conclusion.
5 SUBHARMONIC RECEIVER DESIGNS.
5.1 Illustration of Subharmonic Techniques.
5.2 Mixing Using Antisymmetric I-V Characteristics.
5.3 Impact of Mismatch Effects.
5.4 DC Offset Cancellation Mechanisms.
5.5 Experimental Verification of DC Offset.
5.6 Waveform Shaping Before Mixing.
5.7 Design Steps for APDP-Based Receivers.
5.8 Architectural Illustration.
5.9 Fully Monolithic Receiver Design Using Passive APDP Cores.
5.10 Reconfigurable Multiband Subharmonic Front-Ends.
5.11 Conclusion.
6 ACTIVE SUBHARMONIC RECEIVER DESIGNS.
6.1 Stacking of Switching Cores.
6.2 Parallel Transistor Stacks.
6.3 Extension to Higher-Order LO Subharmonics.
6.4 Multiple Phase Signal Generation from Oscillators.
6.5 Future Direction and Conclusion.
7 DESIGN AND INTEGRATION OF PASSIVE COMPONENTS.
7.1 System on Package (SoP).
7.2 On-Chip Inductors.
7.3 Capacitors.
7.4 Differentially Driven Inductors.
7.5 Transformers.
7.6 On-Chip Filters.
7.7 On-Wafer Antennas.
7.8 Wafer-Level Packaging.
7.9 Conclusion.
8 DESIGN FOR INTEGRATION.
8.1 System Design Considerations.
8.2 IC Floor Plan.
8.3 Packaging Considerations.
8.4 Conclusion.
9 FUTURE TRENDS.
9.1 CMOS Cellphones.
9.2 Multiband, Multimode Wireless Solutions.
9.3 60 GHz Subsystems in Silicon!
9.4 Interchip Communications.
9.5 Ultrawideband Communication Technology.
9.6 Diversity Techniques.
9.7 Conclusion.
Index.