
Electronics Manufacturing Processes
Pearson (Publisher)
Published on 1. March 1994
Book
Paperback/Softback
564 pages
978-0-13-176470-5 (ISBN)
Description
For one semester courses in Electronics or Mechanical Manufacturing in departments of Electrical or Industrial Engineering or Industrial Technology.
An introduction to electronic technology, products, and manufacturing processes.
An introduction to electronic technology, products, and manufacturing processes.
More details
Language
English
Place of publication
United States
Publishing group
Pearson Education (US)
Target group
College/higher education
Dimensions
Height: 240 mm
Width: 180 mm
Thickness: 25 mm
Weight
950 gr
ISBN-13
978-0-13-176470-5 (9780131764705)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Previous edition
Thomas L. Landers | etc. | William D. Browne
Electronics Manufacturing Processes
Book
11/1993
Pearson Education (US)
€32.13
Article exhausted; check for reprint
Content
I. PERSPECTIVES.
1. Introduction to the Electronics Industry.
2. Principles of Production.
II. ELECTRONICS FUNDAMENTALS.
3. Introduction to Electronic Components.
4. Interconnections.
5. Printed Wiring Boards.
6. Soldering and Solderability.
III. AUTOMATIC ASSEMBLY.
7. Principles of Automation.
8. Leaded Component Insertion.
9. Surface-Mount Device Placement.
IV. LIFE-CYCLE ENGINEERING.
10. Design for Assembly.
11. Quality and Reliability.
12. Testability.
13. Environmental Stress Screening.
V. MANUFACTURING SYSTEMS
14. Facilities and Materials Handling.
15. Production and Inventory Control.
16. Production Economics.
Index.
1. Introduction to the Electronics Industry.
2. Principles of Production.
II. ELECTRONICS FUNDAMENTALS.
3. Introduction to Electronic Components.
4. Interconnections.
5. Printed Wiring Boards.
6. Soldering and Solderability.
III. AUTOMATIC ASSEMBLY.
7. Principles of Automation.
8. Leaded Component Insertion.
9. Surface-Mount Device Placement.
IV. LIFE-CYCLE ENGINEERING.
10. Design for Assembly.
11. Quality and Reliability.
12. Testability.
13. Environmental Stress Screening.
V. MANUFACTURING SYSTEMS
14. Facilities and Materials Handling.
15. Production and Inventory Control.
16. Production Economics.
Index.