Chip-Scale Packaging

Chip-Scale Packaging (CSP) is the future for the electronics industry. All the trends point to its use in everything from laptop computers to telecommunications equipment. This technology has virtually exploded over the past few years due to the need for smaller and lighter features in consumer electronics, and currently there are close to 50 different chip scale technologies in development at 30 different companies. The CSPs can be broadly grouped into four types; flexible interposer, rigid interposer, lead frame, and wafer-scale packages. Until now, there has been no single source of information about the construction, reliability, and suitable application of these technologies.This book is structured around design and materials variations in CSP packages within and across the similar architecture-families. It is designed to provide readers with the necessary know-how for technology assessment and insertion into newer generation products and deals with the dominant failure mechanisms in these CSP technologies from theoretical basis to applications.
"Chip-Scale Packaging" fills the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers and technical managers working in electronic packaging and interconnection.