Cover: Reliability, Yield, and Stress Burn-In - Springer

Reliability, Yield, and Stress Burn-In

A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Springer (Publisher)
Published on 14. March 2014
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Paperback/Softback
XXVI, 394 pages
978-1-4613-7596-8 (ISBN)
€160.49incl. 7% vat
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